An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.

A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

Discussed is a display device using a micro light-emitting diode (LED) and a module-type display device where the display device can include a first substrate having a first surface and a second surface, and further having a first electrode placed on the first surface and a second electrode placed on the second surface and electrically connected to the first electrode, a second substrate placed on the first substrate and including a connection wire that defines multiple individual pixel regions, the second substrate being placed on the first substrate so as to have an exposure part through which at least a part of the first electrode of the first substrate is exposed, a connection electrode connecting the first electrode of the first substrate to the connection wire of the second substrate while being in contact with the exposure part, and light-emitting diodes connected to the connection wire of the second substrate.

The vehicle lighting device according to an embodiment includes a socket; a substrate provided on one end side of the socket and having a wiring pattern that includes a mounting pad and a connection pad connected to the mounting pad; a light emitting element being chip-shaped and bonded to the mounting pad using a bonding material; a wire wiring connected to an electrode of the light emitting element and the connection pad; a sealing part covering the light emitting element and the wire wiring; and a suppression part suppressing a component of the bonding material protruding from the light emitting element from reaching a position where the wire wiring is connected to the connection pad.

An electronic device with high density for component arrangement includes a first substrate, a second substrate, a plural of passages formed through the first and the second substrates, a first contact arranged on the first face of the first substrate to conceal the corresponding one of the passages, a second contact arranged on the second substrate and adjacent to the corresponding one of the passages, and a conductor disposed in the passages. A first end of the conductor electrically connects the first contact, while a second end of the conductor electrically connects the second contact.

A light emitting device and a light emitting module having the same are provided. A light emitting device includes: a first conductivity type semiconductor layer; a second conductivity type semiconductor layer; and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, in which, upon operation, the active layer emits light of a first peak wavelength and light of a second peak wavelength in which the first peak wavelength may be within a range of about 400 nm to about 415 nm, and the second peak wavelength may be greater than or equal to about 440 nm.

A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

A light-emitting diode (LED) tube lamp and an electric leakage protection circuit are provided. The LED tube lamp. The LED tube lamp includes a leakage detecting module and a driving module comprising a Type A+B driving circuit. The leakage detecting module is connected with a power supply. The driving module is electrically connected with the leakage detecting module. The leakage detecting module detects a signal related to the output current of the power supply, and when the signal related to the output current of the power supply exceeds a reference signal, the leakage detecting module limits the current on a power loop connected to the power supply by periodically turning off a switch electrically connected to the power loop in series.

A vaporizer device may include a pressure sensor and an ambient pressure sensor. The pressure sensor may be configured to measure a first pressure in an air flow path in the vaporizer device. The ambient pressure sensor may be configured to measure a second pressure corresponding to an atmospheric pressure. The vaporizer device may further include a controller. The controller may be configured to transition the vaporizer device to a first standby mode when the first pressure is equal to or greater than the second pressure for a first threshold quantity of time. While the vaporizer device is in the first standby mode, the controller may be further configured to transition the vaporizer device to a second standby mode when the second pressure is a threshold quantity greater than the first pressure and no motion event is detected for a second threshold quantity of time.

A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.