An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A light-emitting module includes a first mounting board having a first surface and a second surface opposite to the first surface. The first mounting board has a recess on the first surface, and the recess has a bottom surface. The first mounting board has an opening passing through the first mounting board from the bottom surface to the second surface. The light-emitting module further includes a second mounting board provided in the recess, a light-emitting element provided on the second mounting board and configured to emit light through the opening, and an elastic cushion provided between the first mounting board and the second mounting board. The light-emitting module also includes a connector. The connector and the opening sandwich a center of the first mounting board when viewed from a direction from the second surface to the first surface.

An electronic structure includes a substrate having a first surface; a functional unit including a functional section that has an electronic function and a protective member that protects the functional section and having a second surface formed on the first surface’s side; and a support layer provided at a position to contact the first surface and having a third surface in contact with the second surface of the functional unit, area of the third surface being smaller than area of the second surface, wherein one of part of the functional unit forming the second surface of the protective member and part of the support layer forming the third surface contains organic material as its principal component and the other contains inorganic material as its principal component.

A UV reactor irradiates a flow of fluid with UV radiation. The reactor comprises: a fluid conduit defined by a heat conducting conduit body comprising one or more heat conducting walls for permitting a flow of fluid therethrough; a UV-LED operatively connected to a PCB and oriented for directing radiation into the fluid conduit. The PCB comprises a heat conducting substrate having a first surface. The conduit body is in thermal contact with the first surface of the heat conducting substrate. Heat is dissipated from the UV-LED via the heat conducting substrate, the thermal contact between the first surface of the heat conducting substrate and the heat conducting conduit body, and from the one or more heat conducting walls of the heat conducting conduit body to the fluid flowing through the fluid conduit.

An electronic device such as a voice-controlled speaker device may have a housing characterized by a vertical longitudinal axis. A flexible substrate such as a flexible mesh substrate with component support regions coupled by flexible segments may be wrapped around the housing and the vertical axis. The housing may have surface regions with compound curvature. The flexible substrate may conform to the regions with compound curvature. A fabric spacer layer may be interposed between the flexible substrate and the housing. Electrical components such as input-output devices may be mounted to the component support regions. A display may be formed from an array of light-emitting devices that are mounted on respective component support regions. Light from the light-emitting devices may pass through the fabric spacer layer toward the housing and back out away from the housing. An outer fabric layer may cover the mesh.

The invention relates to a method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, having the following steps: a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a), which is coated with a soldering paste (3) and which is designed to electrically, thermally and/or mechanically contact the SMD component (1) to be connected, wherein a number of filled vias (6), which cannot be coated with molten solder, pass through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a), b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) such that the adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) on at least one side of an edge point (R.sub.a, R.sub.b) paired with the soldering paste (3), c) placing an SMD component (1), which comprises at least one component contact surface (1a), on the printed circuit board contact surface (2a) coated with soldering paste (3) such that the at least one component contact surface (1a) electrically, thermally and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, said placement being carried out and the position of said at least one adhesive point (4a, 4b, 4c, 4d, 4e) being selected in step b) such that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e), d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete, and e) heating, melting and subsequently cooling the soldering paste (3) in order to produce an electric, thermal and/or a mechanical connection between the at least one component contact surface (1a) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2), wherein a barrier (5) is formed using the at least one adhesiv

An LED flexible wire lighting in parallel-series connection includes: first flexible wire, second flexible wire, third flexible wire, and a plurality of SMD LED groups; said first flexible wire, said second flexible wire and said third flexible wire are enclosed by non-conductive material without conduction among the wires; said plurality of SMD LED groups are numbered as the first SMD LED group, the second SMD LED group, . . . , the Nth SMD LED group; said plurality of SMD LED groups are connected electrically between said first flexible wire and said second flexible wire in order of said SMD LED groups' number; said third flexible wire is the cathode of said LED flexible wire lighting, and said first flexible wire is the anode of said LED flexible wire lighting. The manual welding connection is reduced and the resistance to tension of lightings in parallel-series connection is enhanced.

An air transport unit comprising a composite board. The composite board comprising an anode layer and a cathode layer of an electrically conducting material. The anode layer and cathode layer are separated by an insulator of an electrically insulating material. The composite board further comprising an electric component in electrical connection with the anode layer and the cathode layer. The air transport unit further comprising a carrier board, wherein the composite board and the carrier board each have a duct forming surface, which carrier board and composite board are arranged so that an air duct forms between the duct forming surfaces.

Provided is an ultraviolet (UV) light source. The UV light source includes: a substrate coupled to an upper housing; a light-emitting diode (LED) package on the substrate; and a waterproof coating layer on at least a portion of the substrate, wherein the LED package includes: an LED chip configured to generate UV light; and a transparent layer including a lower surface facing the LED chip, an upper surface opposite to the lower surface, and a lateral surface connecting the upper surface to the lower surface, wherein at least a portion of the upper surface of the transparent layer is exposed from the waterproof coating layer, and the transparent layer is configured to directly contact a sterilization-target fluid.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.