According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a liquid crystal layer and a light source that emits light to the liquid crystal layer, and the first substrate includes a first portion opposing the second substrate and having a first thickness and a second portion not opposing the second substrate and having a second thickness which is less than the first thickness, and the light source is disposed on the second portion, and the light source includes a first surface opposing the second portion and a second surface opposing the first surface, and a wiring substrate is disposed on the second surface so that the wiring substrate does not protrude with respect to the second substrate in a thickness direction.

A display device includes: a flexible substrate including a display unit and a plurality of peripheral units which surrounds the display unit and are bent to overlap a part of the display unit; a display member positioned at the display unit and which displays an image; and a signal line positioned at the plurality of peripheral units, where the plurality of peripheral units is bent in a way such that parts of the signal line, which are respectively positioned at adjacent peripheral units, are in contact with each other.

Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.

An electronic device such as a voice-controlled speaker device may have a housing characterized by a vertical longitudinal axis. A flexible substrate such as a flexible mesh substrate with component support regions coupled by flexible segments may be wrapped around the housing and the vertical axis. The housing may have surface regions with compound curvature. The flexible substrate may conform to the regions with compound curvature. A fabric spacer layer may be interposed between the flexible substrate and the housing. Electrical components such as input-output devices may be mounted to the component support regions. A display may be formed from an array of light-emitting devices that are mounted on respective component support regions. Light from the light-emitting devices may pass through the fabric spacer layer toward the housing and back out away from the housing. An outer fabric layer may cover the mesh.

A lighting device (1) is provided comprising a support structure (13, 13′), the support structure (13, 13′) comprising a first layer (13a, 13a′) comprising metal and a second layer (13b, 13b′) comprising metal; a central mounting face (18c) formed by a portion of the first layer (13a, 13a′) and by a portion of the second layer (13b, 13b′); and at least one lateral mounting face (18a, 18b) formed by a portion of one of the first layer (13a, 13a′) and the second layer (13b, 13b′); the lighting device (1) further comprising: at least one first light emitting element (11.1, 11.2, 11.3, 11.4, 11.5) arranged on the central mounting face (18c) in contact with the first layer (13a, 13a′) and in contact with the second layer (13b, 13b′); at least one second light emitting element (12a.1, 12a.2, 12a.3, 12a.4, 12a.5, 12b.1) arranged on the lateral mounting face (18a, 18b) in contact with the one of the first layer (13a, 13a′) and the second layer (13b, 13b′) forming the lateral mounting face (18a, 18b), and separated from the other one of the first layer (13a, 13a′) and the second layer (13b, 13b′).

Furthermore, a method for manufacturing such lighting device (1) and an automotive headlight comprising such lighting device (1) are provided.

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

A wiring substrate includes a substrate, an insulating film stacked on the substrate, an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode, a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode, and an auxiliary pad provided to the first surface of the insulating film and having electrical conductivity. The auxiliary pad is disposed in a floating state near an end of the anode pad and the cathode pad.

A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.

A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.

The present disclosure relates to an electronic element module including a printed circuit board including a first insulating layer having a plurality of first openings, and a build-up structure disposed on one surface of the first insulating layer and having a first through-portion, wherein the plurality of first openings are disposed in the first through-portion on a plane; a conductive adhesive disposed in at least a portion of each of the plurality of first openings; and a first electronic element disposed in the first through-portion, and having a plurality of first electrode pads disposed. At least a portion of each of the plurality of first electrode pads is disposed in the plurality of first openings.