An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

Lighting device for a motor vehicle including a light source and/or an optical part. A substrate including electrical tracks, the light source and/or optical part being fastened to the substrate, and a part forming an electrical ground for the electrical tracks. The substrate includes a cut-out forming a tab, electrical tracks of the substrate extending onto the tab, at least one of the tracks on the tab making electrical contact with the ground-forming part.

An LED board includes a flexible printed circuit and multiple LED-mounted parts arrayed on the circuit board at regular intervals in a constant direction. The LED-mounted parts each include multiple LEDs. The circuit board includes LED portions including the LED-mounted parts and non-LED portions including no LED-mounted parts that are arrayed alternately. The LED-mounted parts each have, in an array direction in which the LED-mounted parts are arrayed, a dimension equal to an interval between adjacent LED-mounted parts of the arrayed LED-mounted parts. A surface emitter includes multiple LED boards fitted together, with LED-mounted parts on each LED board overlapping non-LED portions of an adjacent LED board of the LED boards. The LED board and the surface emitter with the above structures easily upsize a video display device.

Provided is a display apparatus including a liquid crystal panel, a substrate, a light source module disposed on the substrate, and a control assembly configured to control the light source module and the liquid crystal panel. The light source module includes a light emitting diode disposed on the substrate, a feed pad provided on the substrate, and at least one antistatic pad provided on the substrate.

Silicone-containing light fixture optics. A method for manufacturing an optical component may include mixing two precursors of silicone, opening a first gate of an optic forming device, moving the silicone mixture from the extrusion machine into the optic forming device, cooling the silicone mixture as it enters the optic forming device, filling a mold within the optic forming device with the silicone mixture, closing the first gate, and heating the silicone mixture in the mold to at least partially cure the silicone. Alternatively, a method for manufacturing an optical component may include depositing a layer of heat cured silicone optical material to an optical structure, arranging one or more at least partially cured silicone optics on the layer of heat cured silicone optical material, and heating the heat cured silicone optical material to permanently adhere the one or more at least partially cured silicone optics to the optical structure.

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

According to one embodiment, an electronic device includes an insulating base including a first portion which is stretchable and a second portion which is adjacent to the first portion and is stretchable, the first portion and the second portion being integrally formed, and electrical elements disposed in the first portion and the second portion, respectively. A first elongation rate of the first portion is different from a second elongation rate of the second portion.

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.

The present invention provides an integrated antenna and visual display apparatus, or one of an antenna apparatus and visual display apparatus which is integratable with the other. Apertures are formed in a visual display, such as an OLED display. The apertures when formed in a conductive layer operate as radiating bodies of an antenna array. A subset of sub-pixels of the visual display can be removed in line with the apertures. An optically transparent substrate is located over the visual display, and an array of further conductive elements, which may be optically transparent, is disposed on an exterior of this substrate. The further conductive elements operate to direct the antenna signals through the substrate, by coupling in an impedance-matched manner with the radiating apertures.

The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.