A circuit board configuration adapted to carry electronic components of a power supply module is provided. The circuit board configuration comprises: a first circuit board, having a first plane configured to dispose and connect a part of the electronic components; and a second circuit board, electrically connected to the first circuit board and having a second plane configured to dispose and connect another part of the electronic components, wherein at least one of the first and the second circuit boards is disposed, perpendicular to an axial direction of the lamp tube, in an interior space formed by the lamp tube and at least one of the two end caps, so that the a direction normal to the first and the second planes is substantially parallel to the axial direction of the lamp tube.

A component mounting method includes an application step of applying a specific solder paste including Sn and a metal other than Sn to a board; a disposition step of positioning and disposing an upper surface reference type component having a positioning reference on an upper surface with respect to one or more reference points on the board; and a reflow step of reflow-soldering the component by heating the board, in which in the specific solder paste, at least a part of the Sn is melted, and molten Sn and the metal other than Sn form an intermetallic compound in the reflow step, thereby fixing the upper surface reference type component to the board.

An electronic cover for an electrical lighting device includes a conducting electrical track structure for lighting components and control components.

A first electronic component (10) includes a terminal (142) and a substrate (100). The substrate (100) includes the terminal (142). At least a portion of a second electronic component (20) overlaps the terminal (142) of the first electronic component (10). A resin film (300) electrically connects the terminal (142) of the first electronic component (10) and the second electronic component (20). The resin film (300) includes a first portion (310) and a second portion (320). The first portion (310) of the resin film (300) overlaps the terminal (142) and the second electronic component (20) when viewed from a predetermined direction (D). The second portion (320) of the resin film (300) does not overlap the substrate (100) or the terminal (142), and overlaps the second electronic component (20) when viewed from the predetermined direction (D).

An illuminating circuit structure includes a film sheet, an illuminant, a printed baseline layer, and a printed pad layer. The printed baseline layer includes a first baseline segment and a second baseline segment printed on the film sheet, while the printed pad layer includes a first bar pad and a second bar pad. For a first baseline head of the first baseline layer and a first pad head of the first bar pad, one of which extends along a first direction and the other of which extends along a second direction not parallel to the first direction. Therefore, the first baseline segment and the first bar pad achieve electrical connection despite of an existed print shifting. Similarly, a second baseline head of the second baseline layer and a second pad head of the second bar pad also can achieve electrical connection despite of an existed print shifting.

A ceiling lamp, an LED light source module, and a light source assembly are provided. The light source assembly includes a plastic heat-dissipating member and a metal substrate for mounting LED light sources of the ceiling lamp. The plastic heat-dissipating member includes an embedding groove, and the metal substrate is embedded in the embedding groove and is in contact with groove walls of the embedding groove. The light source assembly can effectively balance safety, performance and cost.

A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

The present disclosure provides a display device and a splicing screen, relating to the field of display equipment. The display device includes a liquid crystal display screen, a lamp board, and a printed circuit board. The lamp board includes a flexible circuit board and a plurality of light-emitting diodes. The flexible circuit board includes a first part and a second part connected to each other. The light-emitting diodes are disposed on the first part, and the first part is disposed on an edge of a front surface of the liquid crystal display screen. The second part extends outside of the liquid crystal display screen to a rear surface of the liquid crystal display screen and is detachably plugged into the printed circuit board disposed on the rear surface. Since the first part is disposed on the edge of the front surface of the liquid crystal display, a picture displayed on the light-emitting diodes can block an edge region of the liquid crystal display screen. Therefore, when a plurality of display devices is spliced into a splicing screen, split seams can be reduced or even eliminated, thereby improving visual effect.

Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.

A printed circuit structure includes a printed conductive pattern and a printed conductive adhesive pattern. The printed conductive pattern includes a first wire and a second wire. One of a first main contact portion of the first wire and a first main contact portion of a first adhesive of the printed conductive adhesive pattern extends in a first direction, while another thereof extends in a second direction perpendicular to the first direction. With different lengths in the first direction, manufacturing errors between the first wire and the first adhesive in the first direction can be contained without affecting the connection in between. Similarly, a second main contact portion of the second wire and a second main contact portion of a second adhesive of the printed conductive adhesive pattern can also adopt the same design in the first direction to ensure the electric connection.