H05K2201/10113

Printed electronics

The present invention relates to an electronic device comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from a) a flake-less printable composition of 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition.

Flexible LEDs strips with staggered interconnects
11639788 · 2023-05-02 · ·

A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

ILLUMINATED KEYBOARD AND BACKLIGHT MODULE THEREOF
20230380054 · 2023-11-23 ·

A backlight module of an illuminated keyboard device includes a circuit board and a plurality of light-emitting elements. The circuit board has a top surface and a bottom surface opposite to the top surface. The top surface has a plurality of key assembling regions. Each of the key assembling regions has a stress release hole defined through the top surface and the bottom surface. The light-emitting elements are respectively disposed on the key assembling regions. Each of the light-emitting elements includes a main body and a conductive portion connected to the main body. The conductive portion is electrically connected to the circuit board, and the stress release hole is adjacent to the conductive portion of each of the light-emitting elements.

Electronic device

An electronic device is provided, which includes an enclosure, an output component, a display screen and an optical sensor. The output component and the display screen are mounted on the enclosure. The output component includes a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell includes a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate. The display screen is provided with a non-opaque entity region and includes a front surface capable of displaying a picture and a back surface back on to the front surface. The optical sensor is arranged on a side, where the back surface is positioned, of the display screen and corresponds to the non-opaque entity region.

Touch LED component and touch device

A touch LED component and a touch device, and the touch LED component includes a metal cap, a touch button sheathed on an inner wall of the metal cap, and an LED lamp bead coupled to an inner wall of the touch button, a first through hole formed at the top of the metal cap, an induction pin installed at the bottom of the touch button, and an anode pin and a cathode pin installed on both sides of the bottom of the LED lamp bead respectively. The touch device includes a touch panel, a circuit board, and plural touch LED components. The touch LED component with high integration can be packaged by carrier tapes to facilitate automatic plug-ins and simplify production and assembling processes for mass production. The touch device has the features of simple structure, high reliability, good effect and long life.

Wireless charger

Disclosed is a wireless charger. The wireless charger includes a circuit board, a base and two transmitting coils. The circuit board is disposed in the base, a placement panel is disposed on the base, and two placement areas are disposed on the placement panel to carry two induction devices each provided with an induction coil or an induction metal. Two transmitting coils are disposed corresponding to the two placement areas in the base. Each transmitting coil is located below a respective one of the two placement area and electrically connected to the circuit board. The transmitting coil is capable of generating a magnetic field to enable electromagnetic induction with a respective one of the two induction devices so as to charge or heat the respective one of the two induction devices.

Electronic printed circuit board assembly for high-power components

The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (16) formed. Supporting elements (23, 24, 25, 26) are formed on the contact face (21) of the heat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

CEILING LAMP, LED LIGHT SOURCE MODULE, AND LIGHT SOURCE ASSEMBLY

A ceiling lamp, an LED light source module, and a light source assembly are provided. The light source assembly includes a plastic heat-dissipating member and a metal substrate for mounting LED light sources of the ceiling lamp. The plastic heat-dissipating member includes an embedding groove, and the metal substrate is embedded in the embedding groove and is in contact with groove walls of the embedding groove. The light source assembly can effectively balance safety, performance and cost.

Light-emitting device and the method of manufacturing the same

The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.

Lighting device
11066012 · 2021-07-20 · ·

Provided is a lighting device capable of minimizing damage of a joint portion between an operation switch and a substrate or the substrate itself due to a force when the operation switch is operated and improving assemblability. The lighting device includes a housing installed in a vehicle, a substrate fixed to the housing, a cover member which is fixed to the housing and presses down the substrate, a light emitting element installed on the substrate, an operation switch which is installed on the substrate and switches the light emitting element on/off by being operated in directions of coming into contact with and moving away from the substrate, and a movement restricting portion which is formed in the housing, engages with a part of the operation switch and restricts movement of the operation switch toward the substrate side.