Adaptable lens assemblies, optoelectronic components, and associated methods of manufacturing are provided. An example optoelectronic component includes a printed circuit board (PCB) and an adaptable lens assembly. The adaptable lens assembly includes a lens packaging structure supporting an optical lens at a focal distance and a lens support structure. The lens support structure defines a first side configured to support the lens packaging structure and maintain the focal distance and a second side removably attached to the PCB. The attachment between the second side of the lens support structure and the PCB is configured to enable selective attachment and detachment of the lens support structure and lens packaging structure supported thereon without causing damage to the PCB.

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

A lens module includes a circuit board and a photosensitive chip. The first rigid portion includes a first through hole. The lens module further includes a metal board. The metal board includes a metal body and a convex box located on one of the surfaces of the metal body. The circuit board is mounted on a surface of the metal board. The convex box is received in the first through hole. The photosensitive chip is mounted on the convex box. The disclosure also provides an electronic device having the lens module.

A lens module of reduced size includes a base and an adhesive body. The base includes a first base portion and a second base portion located outside the first base portion. The first base portion is made of plastic and the second base portion is made of metal. The base further comprises a slot. The adhesive body is received in the slot and connects the first base portion and the second base portion. The disclosure also provides an electronic device having the lens module.

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below. ##STR00001##