H05K2201/10121

Driver assist system

A driver assist system for a vehicle includes a housing and a lens having an axial end extending into the housing. A first printed circuit board (PCB) is connected to the housing. The first PCB has a rigid portion and a flexible portion. The rigid portion and the flexible portion extend along a common axis. An image sensor is mounted on the rigid portion of the PCB adjacent the axial end of the lens.

Thermal interface for riding heatsink

A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Printed circuit board and electronic device including same

According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.

Modular Deformable Platform
20170367172 · 2017-12-21 ·

A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

Optical Image Stabilization with Voice Coil Motor for Moving Image Sensor

In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator to base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.

Optoelectronic subassembly with components mounted on top and bottom of substrate

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING THE SAME
20220385751 · 2022-12-01 · ·

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

Electrical interconnects within electronic contact lenses
11681164 · 2023-06-20 · ·

An electronic contact lens contains electrical components connected by an electrical interconnect. The electrical interconnect has a flat body, with electrical conductors running length-wise along the body. The flat body is oriented perpendicular rather than parallel to the inner and outer surfaces of the contact lens to reduce a visible profile of the interconnect, reducing the amount of light blocked from entering the eye. The body has a curvature shaped to conform to the curvature of the contact lens. As examples, the interconnect may be connected with an electrical component using a tab perpendicular to the flat body of the interconnect, or by forming an edge connection with electrical contacts of the component located along an edge of the component, or through one or more exposed vias formed on the component.

Camera Module and Array Camera Module Based on Integral Packaging Technology
20170353646 · 2017-12-07 ·

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

ELECTRO-OPTICAL APPARATUS

An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.