An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

Apparatus and method for transferring data in a data storage system, such as but not limited to a hard disc drive (HDD). An optical link is provided between an analog front end (AFE) of a data storage device controller circuit (SOC) and a preamplifier/driver circuit (preamp) mounted to a rotary actuator to transfer an analog domain signal. A selected component is extracted from the signal using a modulation element such as a micro-resonance ring (MRR) or a Mach-Zehnder Interferometer Modulation (MZM) device. The extracted component is forwarded to a processing circuit to facilitate a transfer of data between a local memory and a non-volatile memory (NVM). The optical link includes a flexible portion in a flex circuit affixed to the rotary actuator and which supports the preamp. Multiplexed read, write, and power control signals are concurrently transmitted via the optical link. The link can concurrently service multiple head-disc assemblies (HDAs).

A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.

According to the disclosure, an electronic device may include a printed circuit board, a first component disposed on one surface of the printed circuit board, a second component disposed on the other surface of the printed circuit board, and a metal structure configured to shield electromagnetic interference (EMI) related to the first component, wherein the metal structure includes a first portion configured to cover at least a part of the first component, and a second portion configured to extend from the first portion through the printed circuit board so as to support the second component. Various other embodiments may be possible.

Disclosed are a flexible circuit board component and a display device. The flexible circuit board component includes a flexible circuit board and a foam structure. The flexible circuit board includes a first area and a second area which are arranged in a first direction and connected to each other. The foam structure is located on a side of the first area in the flexible circuit board, and includes a first foam and a second foam, and in the first direction, the second foam is located between the first foam and the second area. After the flexible circuit board component is affixed to a non-light-emitting display side of a display panel, in a direction perpendicular to an interface of the foam structure and the flexible circuit board, a height of the second foam on a side adjacent to the second area is less than a height of the first foam.

Disclosed is an optical receiver. The optical receiver includes a circuit board, a base member, a photodetector mounted on the base member, a transimpedance amplifier, and a capacitor. The base member is disposed between a first grounding pattern and a second grounding pattern on a first side of the circuit board. The transimpedance amplifier is mounted on the first grounding pattern. The capacitor is mounted on the second grounding pattern. The first wiring pattern and the second wiring pattern are apart from both the first grounding pattern and the second grounding pattern in a plan view of the first side. The first grounding pattern is electrically connected to the second grounding pattern through a grounding pattern formed on the first side.

Disclosed is a packaging structure for circuit units, comprising: a circuit baseplate, wherein the circuit baseplate is provided thereon with a circuit unit, the circuit unit including a silicon dioxide layer and an electronic device arranged on the silicon dioxide layer; an insulator, wherein the insulator surrounds the circuit unit; and an electromagnetic shielding layer, wherein the electromagnetic shielding layer covers the circuit unit and the insulator.

A flexible circuit board includes a main board, a first connecting plate, and a second connecting plate; a side surface of the first connecting plate is connected to a first side surface of the main board, and an included angle between the main board and the first connecting plate is a first preset angle; a side surface of the second connecting plate is connected to the first side surface of the main board, and an included angle between the main board and the second connecting plate is a second preset angle; and the first preset angle and the second preset angle are both greater than 0 degree and less than 180 degrees.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.