An optical sensor according to an embodiment of the present disclosure includes a light emitting substrate and a circuit board. The light emitting substrate includes a light emitting device. The circuit board is provided at a position opposing the light emitting device. The circuit board includes a light transmitting section and one or multiple light receiving devices. The light transmitting section transmits light of the light emitting device. The one or multiple light receiving devices receive light reflected by a reflective layer of the light of the light emitting device exiting through the light transmitting section. For example, the one or multiple light receiving devices are formed on a first major surface of the circuit board. For example, the light emitting substrate is disposed at a position opposing a second major surface, of the circuit board, on an opposite side to the first major surface, and is stacked on the circuit board with a first bump interposed therebetween.

A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.

A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

A multilayer PCB structure includes a core layer, a first layer on a first surface of the core layer, a second layer on a second surface of the core layer, and a thermally conductive material in the core layer. The first surface and the second surface of the core layer are opposite to each other, and a window is formed on the second layer by removing part of the second layer. The window of the second layer exposes part of the core layer below the thermally conductive material.

A lens module includes a holder, at least one lens, a base, a sensor, an anisotropic conductive film, a flexible circuit board, and a filling member. The filling member is arranged at a side of the sensor and received in the holder. Along a direction of an optical axis of the lens module, a distance between the side of the sensor and the anisotropic conductive film is defined as a first value, a thickness of the filling member is defined as a second value, a ratio of the second value to the first value is in a range of 0.8 to 1. An electronic device having the lens module is also provided.

A wiring assembly includes a first circuit board, a second circuit board separate from the first circuit board, the second circuit board including a peripheral portion that annularly partially surrounds a periphery of the first circuit board, a first connection portion that connects the first circuit board and the peripheral portion, and a second connection portion that connects the first circuit board and the peripheral portion. The peripheral portion and a portion of the first circuit board between a portion connected to the first connection portion and a portion connected to the second connection portion are annular.

An optical transceiver includes a housing, a heat source accommodated in the housing, and a thermal interface material accommodated in the housing. The housing is in thermal contact with the heat source through the thermal interface material, and the thermal interface material is in physical contact with an uneven surface of the housing.

An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.