A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrode layer is disposed on the first surface. The second sensing electrode layer is disposed on the second surface. The optical film layer covers the first sensing electrode layer and has a first bonding opening located in the bonding area. The protective layer covers the second sensing electrode layer and has a second bonding opening located in the bonding area. The first and second bonding openings respectively expose a part of the first sensing electrode layer and a part of the second sensing electrode layer and are misaligned in a direction perpendicular to the first or second surface.

An object includes an electro-optic display device provided with an optically active element, the optical properties thereof can be modified by applying an electric voltage or current between at least one electrode and one corresponding auxiliary electrode, between which the optically active element is disposed. The object further includes a middle part which delimits an opening closed by a crystal including a bottom surface beneath which the electro-optic display device is arranged. The crystal is provided with an opaque frame which is made remotely from the edges of the opening and which covers the contour of the electro-optic display device so as to conceal electrical connection elements. The electro-optic display device defines an active display area which is confined by the opaque frame, such that, when the electro-optic display device is activated and displaying information, a transparent area remains between the opaque frame and the edges of the opening.

A display screen and an electronic device are provided. The display screen includes an FPC, where the FPC includes a flexible substrate, a first pin, and a second pin, and the first pin and the second pin are disposed on the flexible substrate at an interval; and the flexible substrate is provided with a charge-isolating portion that is disposed between the first pin and the second pin; or the FPC further includes a packaging portion and a moisture-isolating layer, where the packaging portion covers part of the first pin and part of the second pin, and the moisture-isolating layer is disposed between the first pin and the packaging portion and between the second pin and the packaging portion.

The present disclosure provides a display apparatus, a display panel of which includes a panel chip; a second bonding region of a main circuit board is provided with second display terminals coupled with first display terminals and second touch control terminals coupled with first touch control terminals; each of segment touch control lines includes a first segment coupled between one second touch control terminal and one main connector in a first region, and a segment coupled between a touch control chip and one main connector in a second region; a third region and a fourth region of a jumper connection circuit board are bonded with the first region and the second region respectively; the segment touch control lines are in one-to-one correspondence with jumper connection lines, each jumper connection line is coupled between one jumper connector in the third region and one jumper connector in the fourth region.

A display apparatus includes a display panel having an image acquisition region within a display area. The display panel includes a substrate and a plurality of light-emitting elements over the substrate. The plurality of light-emitting elements include one or more first light-emitting elements positionally within the image acquisition region. At least one first light-emitting element includes a non-transparent electrode provided with at least one through-hole configured to allow the lights from the outside pattern to pass through the display panel.

An array substrate, a display panel, and a display device. The array substrate includes a binding region, and the binding region includes a driving chip binding region and a flexible printed circuit binding region. The driving chip binding region is centrally distributed in the binding region, and the flexible printed circuit binding region is distributed on two sides of the driving chip binding region in a second direction. The driving chip binding region includes a first pad, a wiring region and a second pad sequentially distributed in the first direction. The first pad is arranged close to the first region. The second pad includes a second solder joint group and an isolation region, and the second solder joint group is located on two sides of the isolation region in the second direction.

A display device includes: a substrate; an insulating layer on the substrate and including a first opening; a first panel pad on the substrate and the insulating layer; and an anisotropic conductive film on the first panel pad, and the first panel pad includes a center area located at a center of the first opening, and a first edge area and a second edge area arranged along a lateral side of the insulating layer and located on respective sides of the center area with respect to a first direction, and the anisotropic conductive film overlaps at least one of the center area, the first edge area, and the second edge area of the first panel pad.

A flexible circuit board is provided. The flexible circuit board includes a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer extends along a first direction. The adhesive layer is disposed on the first conductive layer and has a first side. The cover layer is disposed on the adhesive layer and has a second side. In addition, a bottom of the first side protrudes from a bottom of the second side in the first direction by a distance.

An electronic device may include a display panel, a plate disposed under the display panel and including a code area in which a unique code is disposed, and a circuit film electrically connected to the display panel. The circuit film includes a first portion, and a second portion extending from the first portion and covering the code area.

Discussed is a display device using a micro light-emitting diode (LED) and a module-type display device where the display device can include a first substrate having a first surface and a second surface, and further having a first electrode placed on the first surface and a second electrode placed on the second surface and electrically connected to the first electrode, a second substrate placed on the first substrate and including a connection wire that defines multiple individual pixel regions, the second substrate being placed on the first substrate so as to have an exposure part through which at least a part of the first electrode of the first substrate is exposed, a connection electrode connecting the first electrode of the first substrate to the connection wire of the second substrate while being in contact with the exposure part, and light-emitting diodes connected to the connection wire of the second substrate.