A polyhedral LED display screen is provided and includes multiple cabinet main frames. Each the cabinet main frame is formed with an accommodating cavity. A side of each cabinet main frame is provided with a flexible PCB, an outer side of the flexible PCB facing away from the cabinet main frame is disposed with LED lamp beads, an inner side of the flexible PCB facing towards the cabinet main frame is magnetically connected to the cabinet main frame, and the cabinet main frames are connected to each other to form a regular dodecahedron sphere. The multiple cabinet main frames can be completely covered by the flexible PCBs, a missing display at an end point in the prior art is eliminated, design numbers and complexities of the cabinet main frames and the flexible PCBs are reduced, and an installation of the cabinet main frames becomes more convenient.

A display device is provided. The display device comprises a display panel comprising an active area for displaying images on a front surface and a non-active area around the active area, and a flexible circuit board comprising at least one conductive line extending from one end to an opposite end, wherein the flexible circuit board is disposed on a rear surface of the display panel to have a loop shape surrounding more than half of at least a part of the active area.

Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

A display device according to an exemplary embodiment of the present invention includes: a first substrate and a second substrate; a plurality of signal lines that are formed on the first substrate or on the second substrate; and a plurality of side wires that are disposed in a side surface of a first edge of the first substrate and a side surface of a second edge of the second substrate, wherein the plurality of side wires are disposed apart from each other along a direction in which the first edge extends, and are connected with the plurality of signal lines, and a first thickness of side wires disposed at an end of the first edge and at and end of the second edge is different from a second thickness of the side wire disposed at inside of the edges of the first edge and the second edge.

A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.

A display device is provided and includes a touch panel including a first substrate, a detection electrode located in a sensor area on the first substrate; an insulating layer covering the detection electrode, a display panel comprising a polarizer opposed to the touch panel; and an insulating material overlapping the detection electrode, contacting the insulation layer and a side surface of the polarizer, and not contacting the detection electrode.

A display device includes a display panel including first pads in a first row and second pads in a second row, a driving circuit board, a first connection circuit board including a first output portion on which first output pads bonded to the first pads of the display panel are disposed, a first input portion on which first input pads bonded to the driving circuit board are disposed, and a first protruding portion, and a second connection circuit board including a second output portion which overlap at least a portion of the first output portion and on which second output pads bonded to the second pads of the display panel are disposed, and a second input portion on which second input pads bonded to the driving circuit board are disposed. At least a portion of the first protruding portion is disposed on the second input portion.

A ruggedized direct-view LED display system (100) includes a bonding matrix (215) that helps secure an array of LED chips (205) to a printed circuit board (PCB) (210). The bonding matrix may consist of an epoxy or other resin deposited on the surface (310) of the PCB after soldering the LED chips to the PCB. The bonding matrix has a thickness that is less than the thickness of the LED chips so that light-emitting outer portions (415) of the LED chips are not covered by the bonding matrix material. A method of forming the bonding matrix is also disclosed, including depositing bonding matrix material onto the PCB between the LED chips using nozzles or needles, optionally wicking excess bonding matrix material, and optionally degassing the bonding matrix material before curing it to form the bonding matrix.

A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

A display device includes a display module, a flexible circuit film, and a cover film. The display module is divided into a first area including pixels, a second area bent with respect to an imaginary axis extending in a first direction, and a third area, on which a driving chip connected to the pixels is disposed. The flexible circuit film is disposed at at least a portion of the third area of the display module and connected to the display module. The cover film covers the second area of the display module, at least a portion of the flexible circuit film, and an entirety of the driving chip.