The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.

A display device includes a display panel including a first signal pad portion including first signal pads, a second signal pad portion including second signal pads, and a first dummy pad portion disposed between the first signal pad portion and the second signal pad portion and including at least one first dummy pad, and a flexible circuit board including a first terminal portion including first terminals, a second terminal portion including second terminals, and a first cut portion disposed between the first terminal portion and the second terminal portion. The flexible circuit board is compressed to the display panel. The first terminals are electrically connected to the first signal pads. The second terminals are electrically connected to the second signal pads. The first cut portion overlaps the first dummy pad portion.

A display device includes a display panel and a lower member disposed under the display panel. The lower member includes a support layer, a digitizer, a flexible circuit board, and a metal layer. The digitizer is disposed under the support layer having an insulating property. The flexible circuit board is connected to the digitizer. The metal layer is disposed under the digitizer, and an opening is defined through the metal layer to correspond to the flexible circuit board.

A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.

An electro-optical device includes a data line selection circuit positioned on a display region side, a first terminal group, a second terminal group, a first video signal line electrically connected to a first terminal of the first terminal group, and a second video line electrically connected to a second terminal of the second terminal group. The first video signal line includes a first portion extending from the first terminal toward the second terminal group, a second portion extending from the first portion in a direction intersecting the first portion, and a third portion extending from the second portion toward the data line selection circuit. The second video signal line includes a fourth portion extending from the second terminal toward the first terminal group, a fifth portion extending from the fourth portion along the second portion, and a sixth portion extending from the fifth portion toward the data line selection circuit.

Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

A display device includes a substrate including a display area and a non-display area adjacent to the display area, lower pads disposed in the non-display area of the substrate and spaced apart from each other, upper pads disposed on the lower pads and spaced apart from each other, an anisotropic conductive film disposed between the lower pads and the upper pads, and a circuit film disposed on the upper pads, the circuit film including first lower holes disposed between the upper pads in a plan view, and first upper holes connected to the first lower holes and having radiuses larger than radiuses of the first lower holes. The first upper holes form first openings on an upper surface of the circuit film. A method of manufacturing the display device is provided.

A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.

An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.