A solar panel module has a flexible circuit board, a matrix of solar cells surface mounted thereto, a coverglass extending over the matrix of solar cells and the flexible circuit board bonded to a rigid support panel. The circuitry including electrical connection pads in an arrangement on the first side surface for electrical connection of the circuitry to each of the matrix of solar cells, flat bypass diodes may be disposed on the first side surface under the cells and connecting to the circuitry. Conductive adhesives adhering each of the solar cells to the flex circuit at the electrical connection pads that correlate to electrical connection points on underside of each solar cells. The first side having a plurality of standoffs for receiving each of the matrix of solar cells providing raised levels for the solar cells, the landing portions projecting outwardly from a base level surface.

Disclosed is an energy harvesting apparatus which comprises: a flexible energy harvesting module having a flat plate shape; a connector which is mechanically and electrically connectable to an external connector; a rigid member having a flat plate shape; and an electric wiring constituting a part of a front surface of the rigid member, wherein an edge of a back surface of the energy harvesting module is disposed on the front surface of the rigid member, and the connector is disposed on the front surface of the rigid member at a position spaced apart from the energy harvesting module and is electrically connected to the energy harvesting module via the electric wiring.

A smart key for a vehicle, including: a case part; a substrate part which is coupled to the case part and on which electronic components are mounted; a plate part which supports the substrate part; a solar power unit which is supported on the plate part and supplies power to the substrate part by means of sunlight; and a sheet part which is coupled to the case part and which covers the solar power unit, so as to be able to operate the vehicle, by way of sunlight, without replacing the battery.

A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

The invention relates to a deformable display, more in particular a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). The invention also relates to the use and applications of such deformable display, including systems and methods making use of such deformable display. In addition the invention relates to a flexible, stretchable and transparent display being deformable in real-time while maintaining deformability.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A flexible hybrid electronics (FHE) device includes a common flexible substrate with a first surface and a second surface opposite the first surface. A printed circuit is coupled to the first surface of the common flexible substrate. A battery is coupled to the second surface of the common flexible substrate. At least one via connects the battery to the printed circuit through the common flexible substrate.

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A photovoltaic device including: a first amorphous semiconductor layer (3) and a second amorphous semiconductor layer (4) both on a back face of a semiconductor substrate (1); electrodes (5, 6); and a wiring board (8). The electrodes (5, 6) are disposed on the first amorphous semiconductor layer (3) and the second amorphous semiconductor layer (4) respectively. The wiring board (8) has wires (82) connected to the electrodes (5) by a conductive adhesive layer (7). The wiring board (8) has wires (83) connected to the electrodes (5) by the conductive adhesive layer (7). The electrodes (5) include conductive layers (51, 52). The electrodes (6) include conductive layers (61, 62). The conductive layers (51, 61) are composed primarily of silver. The conductive layers (52, 62) cover the conductive layers (51, 52) respectively. Each conductive layer (52, 62) is composed of a metal more likely to be oxidized than silver.