A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

The present invention relates to a device for generating electrical energy, comprising a photovoltaic cell (PV) which is connected to a carrier plate (BA) through which fluid can flow in a heat-conducting manner.

A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A process of producing a conducting material suitable for being filled in TSVs for LSI chip 3D package, etc. includes that a solution containing a monomer that provides a conducting polymer, anions, and metal ions such as Ag.sup.+ or Cu.sup.2+ is irradiated with ultraviolet radiation or light having the energy necessary for exciting electrons up to an energy level capable of reducing the metal ions to precipitate a conducting polymer/metal composite. This enables an electrical conductor of high electrical conductivity to be precipitated faster than could be achieved by conventional processes.

A flexible printed circuit for concentrated photovoltaics includes: a conductive layer to which a power generating element is connected; an insulating layer having an insulating property; and a reinforcing layer for reinforcing the insulating layer, the conductive layer, the insulating layer, and the reinforcing layer being joined together in this order. In the flexible printed circuit, the reinforcing layer is formed of a material identical to that of the conductive layer.

The invention relates to a conductive paste, comprising from 50 to 97 wt % of electrically conductive particles, 3 to 50 wt % of an organic medium and 0 to 20 wt % of a glass frit, the organic medium comprising a solvent, wherein the organic medium additionally comprises 10 to 90 wt % of a hydrocarbon-based lubricating oil and 2 to 60 wt % of a polymeric component, each based on the total amount of the organic medium, the polymeric component having a solubility of at least 100 g/kg in the lubricating oil. The invention further relates to a semiconductor device comprising a semiconductor substrate with at least one surface onto which an electrically conductive pattern is printed by using the paste.

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

A solar cell assembly includes a bendable substrate and multiple solar cells to be mounted over different surfaces of an electronic device. The bendable substrate includes an electrical contact to couple to an electrical contact on one of the surfaces of the electronic device. Thus, the electronic device only needs an electrical connection on one surface, and the solar cell assembly can mount solar cells on multiple surfaces to couple to the one electrical connection.

A concentrated photovoltaic receiver and backplane assembly is described herein. A thermally conductive heat spreader is configured between the receiver and the backplane for dissipating at least a portion of the thermal energy in a direction including a horizontal component towards a portion of the heat spreader which is not directly in contact with a receiver portion. In some embodiments, the heat spreader is electrically conductive and is adapted for conducting current from the receiver to the backplane. In some embodiments, a surface area of a receiver substrate is less than 5 times larger than a surface area of a solar cell that is mounted onto the receiver substrate. In some embodiments, the receiver substrate comprises vias for conducting current from a top face to a bottom face of the receiver.

A solar cell panel is discussed. The solar cell panel includes a plurality of solar cells each including a substrate and an electrode part positioned on a surface of the substrate, an interconnector for electrically connecting at least one of the plurality of solar cells to another of the plurality of solar cells, and a conductive adhesive film including a resin and a plurality of conductive particles dispersed in the resin. The conductive adhesive film is positioned between the electrode part of the at least one of the plurality of solar cells and the interconnector to electrically connect the electrode part of the at least one of the plurality of solar cells to the interconnector. A width of the interconnector is equal to or greater than a width of the conductive adhesive film.