A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.

A flexible printed wiring board includes a first strip-shaped member and a second strip-shaped member each including a conductive part and an insulating part covering the conductive part; and a first connecting member including a conductive part and an insulating part covering the conductive part, the first connecting member connecting a first end of the first strip-shaped member and a first end of the second strip-shaped member to each other. The conductive parts of the first strip-shaped member, the second strip-shaped member, and the first connecting member are continuous with each other. The first strip-shaped member and the second strip-shaped member are capable of being linearly arranged when the first connecting member is bent and the first end of the first strip-shaped member and the first end of the second strip-shaped member face each other.

Provided is a foldable photovoltaic solar panel assembly for supplying electric energy to a satellite having a base made of a foldable textile material, with a bidimensional extension, that is reconfigurable between a deployed configuration, in which the base is completely deployed and essentially flat, and a folded configuration in which the base takes a three-dimensional shape of a cube that lacks a face. A plurality of rigid-flexible, printed circuit boards is fixed on the base. Each printed circuit board has a rigid part and a flexible layer for electrically connecting at least one pair of printed circuit boards to each other. A plurality of rigid photovoltaic cells, each fixed on the rigid part of a respective printed circuit board generates an electric current when hit by light radiation.

A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Aspects relate to an integrated system that is electrically powered. The integrated system includes a circuit board and a photovoltaic device. The circuit board includes one or more on-board electronic components and an upper surface configured as a substrate. The photovoltaic device is integrally deposited on the upper surface of the circuit board and electrically connected to the one or more on-board electronic components, wherein the upper surface of the circuit board is a photovoltaic device substrate.

A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member that is disposed on a top surface of the base member and that has flexibility and electrical conductivity; an electronic component that is disposed over the base member and that includes a terminal joined to the electrically conductive member; and a reinforcing member that is disposed on a bottom surface of the base member at a portion corresponding to a portion of the top surface of the base member at which the electrically conductive member is disposed, wherein the reinforcing member is larger in size than an area over which the terminal and the electrically conductive member are joined together.

A deformable display is provided, particularly a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). Methods of use and applications of such deformable display, including systems and methods making use of such deformable display. In addition a flexible, stretchable and transparent display is provided being deformable in real-time while maintaining deformability.