The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.

According to one embodiment, a flexible substrate includes a line portion including a support plate including a first surface, a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, a piezoelectric material covering the line portion, a protective member located on the piezoelectric material and an island-shaped first electrode provided on the insulating base.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

A photonic device includes a PCB having an integrated circuit mounted thereon, with a cap mounted to the PCB and carrying a lens positioned over the integrated circuit. The cap is formed by: an outer wall mounted to the PCB, extending upwardly from the PCB, and surrounding a portion of the integrated circuit; a first retention structure extending inwardly from the outer wall and across the integrated circuit, the first retention structure having a hole defined therein; and a second retention structure having a hole defined therein, the second retention structure being affixed within the first retention structure such that the hole in the second retention structure is axially aligned with the hole in the first retention structure. The lens is mechanically constrained within the cap between the first retention structure and the second retention structure.

Various implementations include a switch assembly that includes a housing and at least one printed circuit board (PCB) disposed within the housing, and one or more force sensors disposed on the PCB. Overload protection is provided for the one or more force sensors using one or both of an energy absorbing pad and/or a force transfer plate having one or more protrusions that engage with a platform defined by the housing to prevent excessive forces from being transferred to the one or more force sensors and damaging them and/or other components of the switch assembly.

A wearable device (100) includes a body (1) and a detection electrode (21). The body (1) includes an electrocardiosignal collection circuit (11), and an inner electrode (12) and an outer electrode (13) that are electrically connected to the electrocardiosignal collection circuit (11). The inner electrode (12) is configured to collect an electric potential signal of a first wearing position (200), and the outer electrode (13) is configured to collect an electric potential signal of a non-wearing position (300). The detection electrode (21) can move relative to the body (1), and the detection electrode (21) is configured to electrically connect to the electrocardiosignal collection circuit (11) and collect an electric potential signal of a second wearing position (400). The non-wearing position (300) and the second wearing position (400) are different from the first wearing position (200). The wearable device (100) can measure electrocardiosignal data in time.

A camera module according to one embodiment of the present invention comprises: a first plate comprising a cavity in which a conductive liquid and a non-conductive liquid forming an interface are disposed; a common terminal disposed on the first plate; a plurality of individual terminals disposed below the first plate; a second plate disposed on the common terminal; a liquid lens comprising a third plate disposed below the individual terminals; a lens assembly comprising at least one solid lens and the liquid lens; a sensor substrate disposed below the lens assembly and having an image sensor disposed thereon; a connection substrate for electrically connecting the liquid lens and the sensor substrate; and a control unit for supplying a driving voltage applied to the common terminal and the individual terminals, wherein the control unit may sense the voltage applied between the common terminal and the individual terminals, and supply the compensated driving voltage to the common terminal and the individual terminals on the basis on the sensed voltage.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

A motorized joint unit comprises a pair of shells defining an inner cavity, the pair of shells adapted to be connected to adjacent links of an articulated mechanism. A rotor and stator in the inner cavity are actuatable to cause a relative rotation therebetween. A shaft connected to the rotor to rotate with the rotor relative to the stator. A support coupled to the shaft by a mechanism, the support being connected to one of the shells to impart a rotation of the shaft to the shell, the support defining an annular wall. One or more strain gauges are located on said annular wall of the support. A printed circuit board (PCB) is applied against the annular wall and electrically connected to the at least one strain gauge, the PCB adapted to be electrically linked to a controller.