An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A flexible and/or stretchable structural system for transmitting electrical signal between first and second rigid portions comprises a body structure and said first and second portions arranged to said body structure. The modulus of elasticity of said first portion is lower than the corresponding modulus of elasticity of said second portion. In addition the modulus of elasticity of said body structure is lower than the corresponding modulus of elasticity of said second portion. The system comprises also an interface portion, such as e.g. an electrically conducting fabric, textile or knit, which is arranged to said body structure and between said first and second portions. The interface portion electrically connects said first and second portions. The modulus of elasticity of said interface portion is lower than the corresponding modulus of elasticity of said second portion.

Described herein is a sensor device. The sensor device comprises a housing and a printed circuit board encased by the housing. The printed circuit board comprises an image sensor that captures image data, an image sensor processor that processes the image data, a serializer that converts one or more data channels associated with the image data into a single data channel, and one or more exposed surfaces. The one or more exposed surfaces dissipate heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing.

In an embodiment, an inductive proximity sensor includes two receiving coils and one transmitting coil arranged between the two receiving coils. The receiving coils and transmitting coil are each formed from a group of at least two individual coils on carrier boards, which are arranged parallel to one another. The carrier boards have a diameter which is smaller than or equal to 10 mm, and a winding of the receiving coils or the transmitting coil has a cross-sectional geometry in which a ratio of a base width to a height lies in the range from 0.2 to 0.3. An embodiment of a method for detecting an object using an inductive proximity sensor includes generating an alternating field using a transmitting coil of the proximity sensor and sensing, using two receiving coils of the inductive proximity sensor, a change in the alternating field caused by proximity of the object.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

A pressure sensor device includes an electrically insulative substrate, a base electrode layer, spacer portions, a guard electrode layer, and a membrane plate. A sensing electrode portion and monitoring electrode portions are located on the membrane plate and face the substrate. In a case where the monitoring electrodes are mounted on a circuit board, the monitoring electrodes detect at least one of stress or strain occurring in or on the spacer portions.

Provided is a power conversion device with which a region in which an electronic component is mountable in a first printed wiring board of a first substrate can be enlarged. The power conversion device includes a power module installing member, a power module, a bus bar assembly, a first substrate provided on the bus bar assembly, and a second substrate provided on the bus bar assembly. The first substrate includes a first printed wiring board, and a signal terminal connector and a first board-to-board connection connector which are each provided on the first printed wiring board. The second substrate includes a second printed wiring board and a second board-to-board connection connector provided on the second printed wiring board. The signal terminal connector is connected to a signal terminal of the power module. The first board-to-board connection connector and the second board-to-board connection connector are connected to each other.

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

The present disclosure illustrates a signal transmission apparatus and a display apparatus using the same. The signal transmission apparatus comprises a first flexible printed circuit board electrically connected to a display module and a system, and comprising a port; and a second flexible printed circuit board electrically connected to the display module, and comprising a port connection member, and the port connection member corresponding to the port. The second flexible printed circuit board is electrically connected to the first flexible printed circuit board through the port connection member and the port, and is further electrically connected to the system. The signal transmission apparatus is used to replace the conventional manner of soldering multiple circuit boards for connection, so as to prevent the variation during the soldering process, and reduce errors of the manufacturing process, and improve yield rate of the display product. Furthermore, compared with the soldering manner, the signal transmission apparatus of the present disclosure improves connection strength between multiple circuit boards.

An electronic device may include a housing, a first printed circuit board being disposed in the housing and including a receiving space formed in at least a portion thereof, and a second printed circuit board being stacked (directly or indirectly) on at least a partial area of the first printed circuit board, the second printed circuit board including a first surface including a plurality of pads configured to be electrically connected with the first printed circuit board and a second surface facing in a direction opposite to the first surface. Other various embodiments are possible.