Patent classifications
H05K2201/10151
LAMP WITH EASY ASSEMBLY AND DISASSEMBLY
Disclosed is a lamp with easy assembly and disassembly comprising a power socket and a lamp body. The power socket comprises a housing and a power supply assembly which is provided in the housing, the power supply assembly is connected with a power supply, the housing is provided with at least one mounting slot which is provided with a press-type locking socket and PCB probes, and the PCB probes are electrically connected with the power supply assembly, a mounting plug with an accommodating groove is provided on the lamp body, a press-type locking plug and a PCB board are provided in the mounting plug; the PCB board is electrically connected to the light source of the lamp body; when the mounting plug is inserted into the mounting slot, the push-type locking plug is inserted into the push-type locking socket and is locked.
LENS MODULE AND ELECTRONIC DEVICE HAVING THE LENS MODULE
A lens module includes a holder, at least one lens, a base, a sensor, an anisotropic conductive film, a flexible circuit board, and a filling member. The filling member is arranged at a side of the sensor and received in the holder. Along a direction of an optical axis of the lens module, a distance between the side of the sensor and the anisotropic conductive film is defined as a first value, a thickness of the filling member is defined as a second value, a ratio of the second value to the first value is in a range of 0.8 to 1. An electronic device having the lens module is also provided.
ELECTRICAL ASSEMBLY
An electrical assembly may include an electrically conductive first member, a magnetic second member, and/or a housing molded on the first member and the second member. A method of assembling an electrical assembly may include disposing the first member in contact with a first mold, disposing the second member in contact with the first mold, moving a second mold into contact with the first mold, and/or inserting a housing material (e.g., liquid plastic) into the first mold and the second mold to form the housing.
SECURE VENTILATION THROUGH PROTECTIVE FLEXIBLE SENSORS
A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.
Metal nanowire ink and method for forming conductive film
Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.
Sensor module and method for operating same
A sensor module includes: a flexible printed circuit board; a temperature sensor disposed on the flexible printed circuit board to measure the temperature of a measurement object; a distance sensor disposed on the flexible circuit board adjacent to the temperature sensor to measure the distance to the measurement object; a terminal cover disposed above the temperature sensor and the distance sensor and including a first hole exposing a top surface of the temperature sensor and a second hole exposing a top surface of the distance sensor; and a window disposed in the second hole of the terminal cover.
Electronic component mounting substrate and manufacturing method thereof
An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.
Electronic devices having image transport layers with embedded circuitry
An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels and may have an input surface that receives the image from the pixels and a corresponding output surface on which the received image is viewable through the cover layer. Circuitry may be embedded within the image transport layer. The circuitry that is embedded within the image transport layer may include capacitive touch sensor circuitry, antenna resonating element structures, input-output components, signal lines, and other circuitry.
DISPLAY DEVICE
A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.
TRANSPARENT COMPOSITE NANOWIRE ELECTRODES
Composite electrodes and their methods of manufacture are disclosed. In one embodiment, an electrode may include a first layer including first particles, a second layer including conductive nanowires, and a third layer comprising second particles. The second layer may be disposed between and in electrical contact with the first layer and the third layer. The composite electrode may be substantially transparent in some embodiments.