The disclosure is directed to a power module apparatus that includes a base plate, a power substrate positioned relative to the base plate, at least two power contacts, a gate-source board mounted relative to the power substrate, gate drive connectors electrically connected to the gate-source board, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to clamp an input to a gate of the at least one power device. The clamping circuit being arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, the gate drive connectors, and the housing. The disclosure is further directed to a process of configuring a power module apparatus.

One or more chip-embedded integrated voltage regulators (“CEIVR's”) are configured to provide power to a circuit or chip such as a CPU or GPU and meet power delivery specifications. The CEIVR's, circuit or chip, and power delivery pathways can be included within the same package. The CEIVR's can be separate from the circuit or chip.

A power module has a plurality of packaged power semiconductors, a printed circuit board, a heat sink, and possibly a sealing compound. The power semiconductors have electrically conductive connection elements and heat removal areas on respective outer sides. The power semiconductors are arranged on a cooling surface of the heat sink and has its heat removal area connected to the cooling surface of the heat sink to conduct heat, and the printed circuit board is arranged on a side of the power semiconductors that is opposite the heat sink in an orthogonal direction, wherein the connection elements of the power semiconductors make electrical contact with pads on the printed circuit board regions, for example, laterally beside an edge of the heat sink, in which a projection of the heat sink onto the printed circuit board in the orthogonal direction does not cover the connection elements.

A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

A wiring substrate includes a first insulating layer, a conductor layer including first and second pads, a second insulating layer having first openings exposing the first pads and a second opening exposing the second pads, metal posts formed on the first pads and filling the first openings, and a wiring structure positioned in the second opening and having first and second connection pads such that the second connection pads are connected to the second pads. The upper surfaces of the first connection pads and the upper surfaces of the metal posts form a component mounting surface having first, second and third regions, the first connection pads are formed in the first, second and third regions and include a group of first connection pads formed in the first and second regions and electrically connected and a group of first connection pads formed in the first and third regions and electrically connected.

The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

A thermal interface for discrete semiconductor devices (such as IGBT's) having a thermally conductive structure, a PCB populated with discrete electronic components, and each of the discrete semiconductor devices having a housing extending beyond the edge of the PCB and in a direction substantially parallel to a plane of the PCB, and a clamp bar secured to the thermally conductive structure adapted to compressively secure each housing to the thermally conductive structure and adapted to maintain thermal contact between a surface of each housing and the surface of the thermally conductive structure. A thermally conductive and electrically insulative pad is positioned between the semiconductor device housing and the thermally conductive structure. A casing enclosing the interface and PCB includes the thermally conductive structure formed on a backwall of the casing.

Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.

A battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement for use in a Li-ion battery, a Li-ion battery having a battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement, and a BMS having a printed circuit board with diagonal arrangement method.