The method comprises the steps of 1) producing first and second blanks (EB1, EB2) by laminating insulating and conductive inner layers (PP, CP, E1) on copper plates forming a base (MB1, MB2), at least one electronic chip (MT, MD) being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. Connection terminal unit includes plurality of connection terminals facing and connected to plurality of terminal connection portions of semiconductor module, and terminal mold portion holding connection terminals. Terminal mold portion has abutment portion that abuts against semiconductor module or base material holding semiconductor module. Abutment portion has vertical abutment portion that abuts against semiconductor module or base material from vertical direction that is a direction in which connection terminals face terminal connection portions, and side abutment portion that abuts against semiconductor module or base material from at least two directions that are different from each other and intersect with vertical direction.

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a first control device and a second control device which are configured to control at least one of charging and discharging of the power supply; a circuit board on which the first control device and the second control device are provided; a first capacitor which is provided on an input side of the first control device so as to be connected in parallel with the first control device; and a second capacitor which is provided on an input side of the second control device so as to be connected in parallel with the second control device, wherein a capacity of the first capacitor is different from a capacity of the second capacitor.

The invention relates to an assembly with an electrotechnical component on a carrier. A first electrical connecting line and a second electrical connecting line going to the electrotechnical component are provided on or in the carrier. The electrotechnical component comprises a first connection and a second connection. The first connection is attached on the carrier by a thermally softenable solder material to the first electrical power supply line, and the second connection is attached on the carrier by a thermally softenable solder material to the second electrical power supply line. A first electrical signal line to the electrotechnical component is provided on or in the carrier. The assembly furthermore comprises a mechanical prestressing, which in the event that the solder material is softened can displace the electrotechnical component on the surface substantially in a parallel plane to the carrier or orthogonally to the carrier.

A control substrate includes: a reverse connection protection circuit; a first substrate wiring connected with a source terminal of a MOSFET of the reverse connection protection circuit; a second substrate wiring connected with a GND terminal; a bypass circuit, allowing, in a case where an output voltage of a vehicle-mounted battery is equal to or greater than a predetermined value, a current to flow from the first substrate wiring to the second substrate wiring; and a clamp circuit, connected with a positive electrode terminal and a GND terminal on an upstream side with respect to the MOSFET and clamps a positive voltage to a second predetermined value. The first predetermined value is a value smaller than a withstand voltage between a gate and a source of the MOSFET.

The disclosure discloses a circuit board, as well as a backlight module and a display device including the circuit board. The circuit board includes a copper exposure region which is covered with a conductive ink. By means of the copper exposure region and the conductive ink thereon, the function of conducting electrostatic charges for the circuit board can be realized at low cost in high efficiency, thereby reducing the risk of subjecting the electrical elements on the circuit board to electrostatic breakdown.

A solid state circuit breaker assembly includes a transistor, a transient voltage suppression device, and a circuit board. The transistor and/or the transient voltage suppression device may be electrically connected to the circuit board. The solid state circuit breaker module may be configured to be connected to one or more non-scalable modules to regulate current. The solid state circuit breaker module may be configured to receive one or more scalable modules. The transistor and/or the transient voltage suppression device may be disposed on the circuit board in a substantially symmetrical configuration.

A LED lighting apparatus has a circuit board and a base. The base is a hollow structure. The base with lateral wall has a conducting element. The circuit board is in the base and has a LED power driving circuit and a LED source. The LED power driving circuit has a full-bridge rectification. A -filter circuit and a non-isolated switch driving circuit connected in order. An output terminal of the non-isolated switch driving circuit is connected with the LED source. The full-bridge rectification, the -filter circuit and the non-isolated switch driving circuit are common grounded to form a power ground. The power ground is electronically connected with the conducting element in order to reduce the interference of an electromagnetic energy generated by the high-frequency switch signal to other appliances.

Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.