The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

A connecting member includes a first part arranged between a first region of an electronic device and a board and a second part arranged between a second region of the electronic device and the board, a distance from an edge to the first part is longer than a distance from a center to the first part, and a distance from the edge to the second part is shorter than a distance from the center to the second part, a space is provided between the electronic device and the board and between the first part and the second part, and, in the board, a through hole communicating with the space is provided not to overlap with the center of the electronic device.

An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.

An electronic module is provided including power switches mounted on a circuit board and configured as an inverter circuit for an electric motor. A sliding member is coupled to an actuator. A power contact switch is provided including a first conductive body, a second conductive body, and a contact switch. The first and second conductive bodies are mounted on a first surface of the circuit board and include pins received through through-holes of the circuit board to make electrical contact with two conductive tracks on a second surface of the circuit board. The contact switch pivotably is secured to the first conductive body and pivotably moveable by the sliding member to make contact with the second conductive body with movement of the actuator. A flyback diode is electrically connected between the first and second conductive track on the second surface of the circuit board parallel to the power contact switch.

A data storage drive includes a memory and a controller communicatively coupled to the memory. A casing encloses the controller and the memory. At least one electrically conductive grounding pad is included on an exterior of the casing. The electrically conductive grounding pad forms a portion of a low impedance path that extends from the grounding pad to a system ground in an interior of the data storage drive. The low impedance path prevents a build-up of static electricity.

A semiconductor module includes: a printed circuit board having a first side and an opposite second side; a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, a first side of the power semiconductor packages facing the first side of the printed circuit board and an opposite second side being configured to be coupled to a heatsink; and at least one bus bar arranged over and electrically coupled to the first side of the printed circuit board. The bus bar is configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages.

A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

The present application discloses a display apparatus having a driver integrated circuit (IC) bonding area for bonding a plurality of signal lines with a driver IC. The display apparatus includes a conductive line layer in a peripheral area of the display apparatus, configured to discharge electrostatic charge in the driver IC bonding area.

Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a first control device and a second control device which are configured to control at least one of charging and discharging of the power supply; a circuit board on which the first control device and the second control device are provided; a first capacitor which is provided on an input side of the first control device so as to be connected in parallel with the first control device; and a second capacitor which is provided on an input side of the second control device so as to be connected in parallel with the second control device, wherein a capacity of the first capacitor is different from a capacity of the second capacitor.