A power supply device includes a covering member, at least one high-height component, and at least one low-height component lower than the high-height component. The covering member includes a reference surface, at least one concave portion recessed from the reference surface toward a side opposite to a side of a circuit board in a Z direction, and at least one convex portion projecting from the reference surface toward the side of the circuit board in the Z direction. The at least one high-height component includes at least one high-height thermally connecting component, a tip end portion of which is thermally connected to a bottom surface of the concave portion, and the at least one low-height component includes at least one low-height thermally connecting component, a tip end portion of which is thermally connected to a tip end surface of the convex portion.

Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.

A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive

According to one or more embodiments of the present disclosure, a pill detection apparatus may comprise a blister pack receiving container, an elastomeric connector layer; and a printed circuit board (PCB) layer disposed beneath the elastomeric connector layer. The PCB layer may include a plurality of touch points, wherein each touch point of the plurality of touch points is configured to, when the blister pack is disposed on top of the elastomeric connector layer, sense whether a respective region of the blister pack is in contact with the elastomeric connector layer. The PCB layer may include a plurality of IR sensors sense properties of a respective region of the blister pack.

A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.

A filtering unit includes a housing having outer walls that define a volume and an inner wall that separates the volume into a first chamber and a second chamber. The filtering unit also includes a rigid/flexible circuit board. The circuit board includes a first rigid portion designed to be positioned in the first chamber. The circuit board further includes a second rigid portion designed to be positioned in the second chamber. The circuit board further includes a flexible portion connecting the first rigid portion to the second rigid portion and designed to extend around the inner wall from the first chamber to the second chamber. The filtering unit further includes a bumper designed to be positioned between one of the outer walls and the inner wall to provide waveguide functionality by reducing an amount of electric field that can pass from the first chamber to the second chamber.

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.