A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.

To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.

A second lead frame is set onto a conductive layer and a busbar. The second lead frame has holes previously formed at opposite ends thereof, and pieces of solder material or solder pieces are inserted into the holes. Then, the solder pieces are vibrated by an ultrasonically vibrating tool, whereby the solder pieces are melted without having a high temperature. The second lead frame is thus bonded to the conductive layer and the busbar. A semiconductor element and the busbar are connected by a first lead frame and the second lead frame. The connection structure thereof is such that the second lead frame to be bonded by ultrasonic bonding or other bonding methods is not directly in contact with the semiconductor element, which eliminates the risk of damage to the semiconductor element.

A method and apparatus to electronically sense air flow and close a switch when air flow is adequate to operate an electric heater, HVACR system, or other apparatus. The apparatus is more reliable than electro-mechanical devices often used for this purpose.

The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (SSDs) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The SSDs are formed from series combinations of transient voltage surge suppressors (TVSs) (metal oxide varistor (MOV), diode for alternating current (DIAC), and/or silicon diode for alternating current (SIDAC)) and corresponding shunt diode rectifiers (SDRs) and placed in parallel across a capacitor structure to locally suppress voltage transients across the capacitor structure in excess of the voltage rating of the capacitor structure. The parallel shunting TVS/SDR pairs may be integrated into a printed circuit board (PCB) assembly that is externally attached to the capacitor structure or encapsulated in an enclosure incorporating the capacitor structure.

An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.