This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.

This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.

A switching power supply apparatus includes a printed substrate, a transformer, a primary-side circuit, a secondary-side circuit, and some components. A semiconductor element is mounted on the printed substrate. A heat sink includes a connection portion and dissipates heat generated in the semiconductor element. The connection portion is connected to the printed substrate by soldering. A conductive pattern is formed on the printed substrate. An inductor is connected between the connection portion of the heat sink and a part of the pattern, and absorbs electrical noise induced to the heat sink.

Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

A semiconductor module, including a first main wiring line connecting portion and a second main wiring line connecting portion, and a main output wiring line connecting portion is provided. The circuit board includes a circuit region in which the first circuit and the second circuit are arranged alongside each other in the first direction, and a first connecting region and a second connecting region arranged sandwiching the circuit region in a second direction orthogonal to the first direction. The first main wiring line connecting portion and the second main wiring line connecting portion are provided in the first connecting region, and the main output wiring line connecting portion is provided in the second connecting region.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol generation source; and a charger including an information input part, and configured to be able to supply one of a first charging voltage and a second charging voltage lower than the first charging voltage to the power supply, based on an input value which is input from the information input part. A fixed value which is predetermined as one input value can be input to the information input part, and the fixed value is a value for supplying the second charging voltage to the power supply.

The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

Embedded cooling systems and methods of forming the same are disclosed. A system includes a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of each power device stack, and a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.

An alternating current LED filament includes a base board, rectifier diodes and light-emitting diodes. Two ends of the base board are provided with connecting terminals, and two conductive circuits are arranged on the base board. Two ends of each of the two conductive circuits are respectively connected to an external power supply through an at least one rectifier diode of the rectifier diodes. The rectifier diodes at two ends of a same conductive circuit are arranged in a reversed direction, the rectifier diodes connected to different conductive circuits on a same connecting terminal are arranged in the reversed direction, and the light-emitting diodes are connected to the two conductive circuits. A connecting terminal of the connecting terminals is connected to a corresponding conductive circuit through the at least one rectifier diode to improve a reverse withstand voltage capability.

A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.