An alternating current LED filament includes a base board, rectifier diodes and light-emitting diodes. Two ends of the base board are provided with connecting terminals, and two conductive circuits are arranged on the base board. Two ends of each of the two conductive circuits are respectively connected to an external power supply through an at least one rectifier diode of the rectifier diodes. The rectifier diodes at two ends of a same conductive circuit are arranged in a reversed direction, the rectifier diodes connected to different conductive circuits on a same connecting terminal are arranged in the reversed direction, and the light-emitting diodes are connected to the two conductive circuits. A connecting terminal of the connecting terminals is connected to a corresponding conductive circuit through the at least one rectifier diode to improve a reverse withstand voltage capability.

A LED lighting apparatus has a circuit board and a base. The base is a hollow structure. The base with lateral wall has a conducting element. The circuit board is in the base and has a LED power driving circuit and a LED source. The LED power driving circuit has a full-bridge rectification. A π-filter circuit and a non-isolated switch driving circuit connected in order. An output terminal of the non-isolated switch driving circuit is connected with the LED source. The full-bridge rectification, the π-filter circuit and the non-isolated switch driving circuit are common grounded to form a power ground. The power ground is electronically connected with the conducting element in order to reduce the interference of an electromagnetic energy generated by the high-frequency switch signal to other appliances.

An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol generation source; a temperature measuring unit configured to measure temperature of the power supply; and a control device configured to control first power or a first amount of power to be supplied to the power supply in a case where a measurement value of the temperature measuring unit is equal to or higher than a first threshold, to a value smaller than second power or a second amount of power to be supplied to the power supply in a case where the measurement value is lower than the first threshold.

According to one embodiment, a flexible substrate includes a flexible insulation base material and a plurality of wiring lines provided on one surface side of the insulation base material, and the insulation base material includes a thinned first area and a second area having a thickness larger than that of the first area, the first area includes a first lower surface, the second area includes a second lower surface, the first lower surface and the second lower surface are formed on an opposite side of a surface on which the wiring lines are provided, and the first lower surface includes an inclined portion inclined towards the second lower surface.

Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a connector able to be electrically connected to an external power supply; and a control device. The power supply unit further includes: a conductor which electrically connects the connector and the control device; a capacitor provided between the connector and the control device so as to be connected in parallel with the control device; a first circuit board on which the connector is provided; a second circuit board which is apart from the first circuit board and on which the capacitor and the control device are provided; and a conductive member which electrically connects the first circuit board and the second circuit board.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a connector able to be electrically connected to an external power supply; a control device configured to control at least one of charging and discharging of the power supply or configured to be able to convert power which is input from the connector into charging power for the power supply; and a zener diode provided between the connector and the control device so as to be connected in parallel with the control device. A maximum value of zener voltage of the zener diode is lower than a maximum operation guarantee voltage of the control device.

An electronic module includes a circuit board having a mounting surface; a heat generating component mounted on the mounting surface; a frame supporting the circuit board; a cover covering the heat generating component and the mounting surface; and a heatsink mounted on the mounting surface. The heatsink includes at least one wall including a particular wall to which the heat generating component is attached. The heatsink further includes a shade portion provided at the at least one wall. The shade portion is located between the cover and the heat generating component in a direction perpendicular to the mounting surface.

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.