According to certain embodiments, an electronic device comprises: a housing; an electronic component disposed in the housing, wherein the electronic component generates heat during operation; a support cover disposed on the electronic component; a metal member overlapping with the electronic component while interposing the support cover between the metal member and the electronic component; a switching unit selectively forming or disconnecting an electrical connection path of the support cover and the metal member; and at least one processor configured to select an antenna tuning code, based at least in part on whether the switching unit forms or disconnects the electrical connection path, wherein the switching unit includes: a receiving member electrically connected to the support cover and providing a receiving space; a thermally deforming member received in the receiving space, wherein the thermally deforming member deforms based on a temperature; and an elevating member configured to move upwardly to electrically connect the metal member to the support cover, when the thermally deforming member deforms.

A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected to the first cabling layer or the second cabling layer. When the chip is short-circuited, the protection structure blows first.

A novel fuse device incorporates electrically-conductive metal-filled vias that vertically connect frontside metal pads with backside metal pads through an electrically-insulated base substrate. The vias are initially created by drilling through the base substrate and then completed by filling the drilled vias with an electrically highly-conductive metallic substance. The vertical electrical connection between the frontside metal pads and the backside metal pads, established by the vias in the fuse structure, enables packageless integration of the novel fuse device to an electronic circuit by eliminating the structural need for wire bond pads and conventional leadframe or cavity packages. Preferably, each frontside metal pad of the novel fuse device is connected to an electrical terminal of the electronic circuit requiring fuse-based power protection, and each backside metal pad is attached to a printed circuit board (PCB) containing the electronic circuit for seamless direct mounting of the fuse structure.

The invention relates to an overvoltage protection arrangement having: a plurality of planar varistors 2, 21, 22, which are arranged on a first side of a supporting plate 7; at least one gas arrester 10; and at least one thermal disconnection device, which is in close thermal contact with at least one of the varistors. The aforementioned components are surrounded by an outer housing 1, and electrical connection means 6, 61 for soldering to a printed circuit board are also provided on the second side of the supporting plate. The varistors 2, 21, 22 have a parallel stack arrangement, which is delimited on each of two opposing sides by an insulating partition wall 3, 31 which can be attached to the supporting plate. Each partition wall has at least one opening for a varistor terminal (62), each varistor terminal being connected to a thermal disconnection device, which in turn comprises a spring-loaded disconnecting lever (80), the respective disconnecting lever being connected at its first end to the respective varistor terminal by a soldered connection (18) and wherein its second end merges into one of the electrical terminals 6, 61 and penetrates through the supporting plate 7. The thermal disconnection device also has an insulating slide 4, whose free end acts on the disconnecting lever (80), wherein the slide runs in recesses in the respective partition wall 3, 31, and a change in the position of the slide can be seen by means of a viewing opening 8 in the outer housing 1.

A liquid food or beverage preparation machine that includes a fluid arrangement and a printed circuit board for controlling one or more functions of the fluid arrangement, with the printed circuit board being enclosed within a substantially impervious housing to protect the printed circuit board from fluid or vapor emissions from the fluid arrangement.

A combination of a flow meter and printed circuit board or flex-print for a liquid food or a beverage preparation machine, which board or flex-print is rigidly connected to the flow meter. This combination is used in a liquid food or beverage preparation machine that includes an in-line heating device in which machine liquid is circulated through the heating device and then guided into a brewing chamber that includes a capsule or pod housing for brewing a food or beverage ingredient supplied into the brewing chamber.

The present application discloses a circuit board and a method for manufacturing the same, and a terminal test device. The circuit board includes a base substrate, and a plurality of conductive lines on the base substrate, each of the plurality of conductive lines having one end configured to be connected with a signal output bus of a signal generator and the other end configured to be connected with a terminal. A fuse is connected in series in each conductive line, and a breaking current IT of the fuse, a maximum operating current I of the conductive line and a fault current IF of the conductive line satisfy: I<ITIF, where the breaking current IT of the fuse is a minimum current that causes the fuse to open.

A fuse holder includes a holder base comprising a plurality of protrusions each having a mounting hole formed therein to provide for mounting of the holder base to an external component and one or more mating protrusions and one or more mating slots formed on each of opposing side surfaces. The fuse holder also includes an input stud coupled to or formed on the holder base and a cover configured to attach to the holder base to at least partially enclose one or more fuses positionable on the fuse holder. The one or more mating protrusions and the one or more mating slots formed on each of the opposing side surfaces of the holder base comprise dovetailed protrusions and slots of a matching profile capable of receiving such a dovetailed protrusion, so as to enable a side-by-side stacking and interlocking of fuse holders with such mating protrusions and mating slots.

A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110). The encapsulating colloid (2) seamlessly encapsulates the electronic circuit (3) and isolates the electronic circuit (3) from the air, such that a problem that the electronic circuit (3) is directly exposed to the air, and performances of components of the electronic circuit (3) may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.