A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

An LED lighting device includes: a bulb shell; a light-source board having a connector, the light-source board disposed in the bulb shell for generating optical light; a conductive rivet disposed on a bottom of the LED light device; and a fusible resistor having a first conductive-line terminal clamped by the connector and a second conductive-line terminal coupled to the conductive rivet.

Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a first and second electrical terminal of the circuit board via conductive tracks, wherein: the varistor is connected to the first terminal by a first track, the discharge tube is connected to the varistor by a second track, the discharge tube is connected to the second terminal by a third track, and wherein the second and third tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate the corresponding track into two parts in response to an overcurrent, the distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

Oscillation mitigation circuits are implemented in a system for supplying electric power to load circuit boards, for example, load circuit boards entirely immersed into a bath of dielectric heat transfer fluid. The oscillation mitigation circuits can be used to protect the load circuit boards, including the connectors mounted on these load circuit boards, from an anomalous behavior of the electric power. The oscillation mitigation circuits are coupled between wire bundles forming a portion of the electric power supply and the connectors mounted on the load circuit boards.

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

A battery pack system is provided with an integrated battery disconnect mechanism. The battery pack system includes a circuit board and one or more battery packs connected to the circuit board. A battery pack of the one or more battery packs is connected to the circuit board via one or more connectors. The battery pack system also includes a disconnect mechanism configured to disconnect the battery pack from the circuit board with a failure event at the battery pack by disconnecting the one or more connectors connecting the battery pack to the circuit board. In an enhanced aspect, the battery pack is suspended from the circuit board by the one or more connectors, and the disconnecting of the one or more connectors by the disconnect mechanism with the failure event releases the battery pack to drop away from the circuit board.