Patent classifications
H05K2201/10189
Vibration isolator and method of assembly using flex circuits
A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.
Electrical connection system comprising a primary connection device and a secondary connection device
Electrical connection system comprising a primary connection device and a secondary connection device, the primary connection device comprising a shielded cap and primary conductive contacts which extend at least partially inside the shielded cap, the secondary connection device comprising a secondary electrical board which has a secondary mass surface, secondary conductive contacts which extend from an installation surface of the secondary electrical board which is surrounded by the secondary mass surface, and a resilient conductive material which is attached to the secondary mass surface, the electrical connection system being arranged so that the primary conductive contacts are electrically connected to the secondary electrical contacts inside the shielded cap and the shielded cap extends on the resilient conductive material by compressing it.
ELECTRICAL CONNECTORS AND PRINTED CIRCUITS HAVING BROADSIDE-COUPLING REGIONS
An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.
ELECTRICAL DEVICE, MODEL SERIES OF ELECTRICAL DEVICES, AND PRODUCTION METHOD
In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.
INTERPOSER DEVICE
An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.
ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTOR OR SEMICONDUCTOR PACKAGING SUBSTRATE
An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. The resulting terminal shape is defined by the shape of the cavity created in the resist layers. Complex terminal shapes are possible. The present conductive terminals are particularly useful for electrical interconnects and semiconductor packaging substrates.
MATABLE ELECTRICAL INTERCONNECTION STRUCTURE AND ELECTRICAL DEVICE HAVING THE SAME
Provided is a matable electrical connection structure including a female connection member and a male connection member respectively including a plurality of first connection portions and a plurality of second connection portions, and a plurality of matable connection portions configured to detachably couple the female connection member and the male connection member, and respectively and electrically connect the plurality of first connection portions to the plurality of second connection portions, and the matable connection portions include inner conductive materials respectively and electrically connected to the plurality of first connection portions and provided on inner walls of a plurality of insertion holes formed in the female connection member, columns respectively and electrically connected to the plurality of second connection portions and configured to protrude from the male connection member to be inserted into the insertion hole, and elastic fins configured to extend outside the column to elastically contact the inner conductive material, and at least one of the female connection member and the male connection member is divided into a plurality of areas, and the plurality of matable connection portions are disposed to form a group in each of the areas.
Cable receptacle connector for a communication system
A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.
Terminal module and backplane connector having the terminal module
A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.
Terminal module and backplane connector having the terminal module
A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.