H05K2201/10189

Backplane connector with improved shielding effect

A backplane connector includes a housing and a number of terminal modules. Each terminal module includes a number of conductive terminals, a metal shield surrounding member, a first metal shield and a second metal shield. The conductive terminal includes a mating portion and a tail portion. The conductive terminals include a first signal terminal and a second signal terminal. The metal shield surrounding member surrounds the mating portions of the first signal terminal and the second signal terminal. The first metal shield and the second metal shield are in contact with the metal shield surrounding member. As a result, the shielding area is increased and the shielding effect is improved.

CIRCUIT BOARD ASSEMBLY
20230009150 · 2023-01-12 ·

This application relates to a circuit board assembly. The circuit board assembly includes: a first circuit board. The first circuit board is connected to a connector; and a second circuit board. A first connecting portion is disposed on the second circuit board. The first connecting portion is electrically connected to the connector. The second circuit board includes a top surface and a side surface. The top surface intersects and is perpendicular to the side surface. The first connecting portion is disposed on the top surface, and extends towards the side surface. In this disclosure, the top surface intersects and is perpendicular to the side surface, to improve stability of connection between the connector and the first connecting portion, and improve working stability of the second circuit board, so as to improve working performance of the circuit board assembly and improve user experience.

Board-like connector, dual-arm bridge of board-like connector, and wafer testing assembly

A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.

HIGH FREQUENCY IMPEDANCE MATCHING EDGE LAUNCH RF CONNECTOR
20230216256 · 2023-07-06 ·

An edge launch radio frequency (RF) signal connector includes ground contact tabs that have radially extending arms. The arms cover a gap between a substrate, such as a circuit board, and the connector to reduce the RF ground path between the RF reference ground and a signal pin supported by the connector. The arms extend radially inwardly from the protruding ground contact tabs toward a central support aperture that supports the signal pin. The arms and the ground contact tabs are formed integrally with the main connector body as one piece. The arms and the ground contact tabs may be planar in shape such that the arms and the ground contact tabs lie flush on the substrate when the connector is arranged over the edge of the substrate.

Wearable device and wearable system

A wearable device includes a skin-attachable device to be attached to a skin of a user to acquire user data, an electronic device that supplies power to the skin-attachable device, and a connection device including a first cable connected to the skin-attachable device and a second cable connected to the first cable and detachably attached to the electronic device.

Technologies for assigning workloads to balance multiple resource allocation objectives

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

Connector with tolerance module

A connector with a tolerance module includes a socket and a plug adapted to the socket, wherein the socket includes a first housing, the plug includes a tolerance module and a third housing, the tolerance module includes a second housing, the second housing includes second contact members, the second housing is movably arranged on the third housing in a direction perpendicular to the axial direction of the connector, and the second contact members are floatingly assembled in the second housing to enable displacement in the direction perpendicular to the axial direction of the connector. The second housing only generates translational motion without displacement when the connector is inserted. The tolerance of the plug and the socket is realized by the floating assembly of the second contact members in the second housing.

Electronic device including structure for stacking substrates

An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

CASE AND OPTICAL UNIT
20230004066 · 2023-01-05 ·

A case includes a movable body to which an optical module having a first flexible wiring board is to be attached, a fixed body, and a second flexible wiring board with which the first flexible wiring board is to be connected. The movable body is swingably held by the fixed body, and the second flexible wiring board is structured to be resiliently bent easier than the first flexible wiring board.

Mating backplane for high speed, high density electrical connector

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.