A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).

A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).

The present invention is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board.

To prevent both increase in impedance and a short circuit, a connector cable is configured such that a connector and a shielded cable are connected via a relay substrate. The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric. The inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor. At least directly under a part where the shield member is removed to expose the dielectric, a ground (GND) conductor layer on a front surface of the relay substrate is arranged. The GND conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member.

A connection system for a printed circuit board employs either an inline or transverse board-mounted connector for holding board-mounted optical fibers. A plug-in connector can blind mate with the board-mounted connector. The plug-in connector has a plug-in connector body, a plug-in ferrule, and a plug-in ferrule holder. The plug-in holder latches with the plug-in connector body at either of two positions to selectively configure the plug-in connector for blind mating with either the inline or transverse board-mounted connector. The board-mounted fibers can be supported by a board-mounted ferrule assembly including a ferrule and a ferrule holder that is configured to selectively attach the board-mounted ferrule assembly to either of an inline board-mounted connector body and a transverse board-mounted connector body.

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.

An electronic system for a vehicle includes: a first module including: a first circuit board having a predetermined form factor; a first module on the first circuit board and including a plurality of pins; a first electrical connector disposed on a first surface of the first circuit board and including a plurality of pins; and a plurality of electrical conductors connecting the pins of the first electrical connector with the pins of the first module, respectively; and a second module including: a second circuit board having the predetermined form factor; a second module on the second circuit board and including a plurality of pins; a second electrical connector disposed on a first surface of the second circuit board and including a plurality of pins, the second electrical connector coupled to the first electrical connector.