A battery system includes one or more shear walls to provide support. A shear wall may include a support structure and conductive traces to route signals or measurements without the need for wire runs. The support structure may help to maintain the arrangement of battery cells of the battery system, while the conductive traces allow voltages among the battery cells to be monitored. Busbars, or other electrical terminals, may be coupled to the conductive traces of the shear wall, and processing equipment may also be coupled to the conductive traces. Accordingly, the processing equipment may monitor voltage among the battery cells, which may allow balancing among battery modules, diagnostics, and other functions. The shear wall may be constructed of FR-4 or other circuit board material, and the conductive traces may include bonded copper, or other electronically conductive material.

Electronic parts for improving an isolation distance are provided. The electronic part includes: at least one plate; and first and second terminals each connected to the plate, wherein the electronic part is mounted in a PCB through the first and second terminals and a creepage distance between the first terminal and the second terminal is greater than a clearance distance between the first terminal and the second terminal.

A surge protection device has a housing that is formed from a first lateral portion, a middle portion, and a second lateral portion that are connected together with a plurality of fasteners. The surge protection device includes an electronic apparatus having a neutral wire and further includes a housing that advantageously includes a strain relief that causes the neutral wire to frictionally engage the housing with sufficient friction to resist a predetermined tension applied to the free end or other portion of the neutral wire at the exterior of the housing from damaging an electrical connection between the neutral wire and a circuit board within an interior region of the surge protection device.

A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (SSDs) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The SSDs are formed from series combinations of transient voltage surge suppressors (TVSs) (metal oxide varistor (MOV), diode for alternating current (DIAC), and/or silicon diode for alternating current (SIDAC)) and corresponding shunt diode rectifiers (SDRs) and placed in parallel across a capacitor structure to locally suppress voltage transients across the capacitor structure in excess of the voltage rating of the capacitor structure. The parallel shunting TVS/SDR pairs may be integrated into a printed circuit board (PCB) assembly that is externally attached to the capacitor structure or encapsulated in an enclosure incorporating the capacitor structure.

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.

An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

Devices and methods for remotely monitoring and treating wounds or wound infections are disclosed. A device can include a multi-layered, flexible substrate having a dressing layer positioned on a wound side of the substrate, and a flexible printed circuit board layer positioned on an electronics side of the substrate that is opposite the wound side of the dressing layer. A plurality of electrodes can be electrically coupled to the flexible printed circuit board. A plurality of temperature sensors can be electrically coupled to the flexible printed circuit board. Systems including the described devices are also disclosed.

A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.