Patent classifications
H05K2201/10196
Redundant traces for flexible circuits used in an energy delivery device
Energy delivery devices with a flexible circuit. The energy delivery devices may be used in the treatment of human tissue, and the flexible circuit move or flex during use. The flexible circuit may include an electronic component and a trace connected with the electronic component. The trace may have a plurality of sections that provide parallel current paths over a portion of the trace. Alternatively, the flexible circuit may include a plurality of traces that are connected with the terminal of the electronic component to provide parallel current paths over their entire length to the terminal of the electronic component. These redundant parallel current paths improve device reliability.
TEMPERATURE MEASURING DEVICE
Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.
Thermal substrate with high-resistance magnification and positive temperature coefficient
A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.
A PCB STRUCTURE FOR EMBEDDING ELECTRONIC COMPONENTS
A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.
CIRCUIT BOARD ASSEMBLY
Provided is a circuit board assembly including an electronic component that generates heat, and a thermistor that is mounted on a circuit board that is spaced apart from the electronic component and that detects the temperature of the electronic component. The circuit board assembly further includes a heat conductive pattern formed surrounding the thermistor, and a heat conductive member that conducts heat from the electronic component to the heat conductive pattern.
Redundant traces for flexible circuits used in an energy delivery device
Energy delivery devices with a flexible circuit. The energy delivery devices may be used in the treatment of human tissue, and the flexible circuit move or flex during use. The flexible circuit may include an electronic component and a trace connected with the electronic component. The trace may have a plurality of sections that provide parallel current paths over a portion of the trace. Alternatively, the flexible circuit may include a plurality of traces that are connected with the terminal of the electronic component to provide parallel current paths over their entire length to the terminal of the electronic component. These redundant parallel current paths improve device reliability.
Radio frequency identification tag and manufacturing method thereof
Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.
STANDOFF FOR CIRCUIT BOARD HAVING TEMPERATURE-VARIABLE ELECTRICAL ELEMENT
A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.
Carrier with a passive cooling function for a semiconductor component
The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).
Functional contactor for an electronic device
A functional contactor is provided. The functional contactor contains a conductive elastic portion having elasticity and electrically contacting one of a circuit board of an electronic device, a bracket coupled to the circuit board, and a conductor which can come into contact with the human body; a substrate containing a plurality of dielectric layers; and a functional element embedded in the substrate so as to be electrically connected in series to the conductive elastic portion.