An adjustable and pluggable control interface device with a sensor thereof includes a sensor and at least one adjusting member. The sensor includes a PCB, a sensing portion and at least one adjusting portion. The PCB is electrically connected to the sensing portion and the adjusting portion, respectively, and the at least one adjusting portion is configured to adjust output signals of the PCB. The at least one adjusting member is inserted into the adjusting portion for adjusting the output signals of the PCB. The structure of the present disclosure can control external lamps to light or extinguish so as to realize the functions of dimming light brightness, setting light duration, adjusting energy-saving parameters and proportion. So, such structure can be easily operated with a wide range of applications.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.

The invention relates to an assembly with an electrotechnical component on a carrier, wherein the electrotechnical component is arranged on the carrier, wherein a first electrical connecting line and a second electrical connecting line going to the electrotechnical component are provided on or in the carrier, wherein the electrotechnical component comprises a first connection and a second connection, wherein the first connection is attached on the carrier by a thermally softenable solder material to the first electrical power supply line, and wherein the second connection is attached on the carrier by a thermally softenable solder material to the second electrical power supply line, wherein a first electrical signal line to the electrotechnical component is provided on or in the carrier, wherein the first connection on the carrier is also attached by a thermally softenable solder material to the first electrical signal line, wherein the assembly furthermore comprises a mechanical prestressing, which in the event that the solder material is softened can displace the electrotechnical component on the surface substantially in a parallel plane to the carrier or orthogonally to the carrier so that the electrical attachment of the first electrical power supply line, the second electrical power supply line and the first electrical signal line is interrupted such that a potential can now be measured between the first electrical power supply line and the first electrical signal line.

A printed circuit board (PCB) carrier including a multi-layer structure including a plurality of conductive layers and a plurality of insulating layers respectively spaced between the plurality of conductive layers, the multi-layer structure having a footprint corresponding to a large size component of the PCB, and a pocket formed in the multi-layer structure, the pocket configured to receive a discrete component of a size smaller than the large size component.

A printed circuit board (PCB) carrier including a multi-layer structure including a plurality of conductive layers and a plurality of insulating layers respectively spaced between the plurality of conductive layers, the multi-layer structure having a footprint corresponding to a large size component of the PCB, and a pocket formed in the multi-layer structure, the pocket configured to receive a discrete component of a size smaller than the large size component.

A surge protection device has a housing that is formed from a first lateral portion, a middle portion, and a second lateral portion that are connected together with a plurality of fasteners. The surge protection device includes an electronic apparatus having a neutral wire and further includes a housing that advantageously includes a strain relief that causes the neutral wire to frictionally engage the housing with sufficient friction to resist a predetermined tension applied to the free end or other portion of the neutral wire at the exterior of the housing from damaging an electrical connection between the neutral wire and a circuit board within an interior region of the surge protection device.

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

A functional contactor is provided. The functional contactor according to one embodiment of the present invention includes: a conductive elastic portion configured to be in electrical contact with a conductor of an electronic device and have elasticity; and a functional device including a first electrode electrically connected to a circuit board or the conductor of the electronic device and a second electrode on which the conductive elastic portion is laminated through solder. Here, the second electrode includes a stopper in which no electrode is formed to prevent the solder from being introduced into a periphery of a lamination region on which the conductive elastic portion is laminated.