A wiring substrate includes a glass core layer; first and second wiring layers on first and second surfaces, respectively, of the glass core layer; first and second organic insulating layers covering the first and second wiring layers, respectively; first dummy pads provided one in each of corner areas of the first surface and electrically independent of the first wiring layer, second dummy pads provided one in each of corner areas of the second surface and electrically independent of the second wiring layer, and dummy through vias piercing through the glass core layer to connect the first and second dummy pads. In each corner area of the first surface, the distance from the apex of the corner area to the center of the nearest dummy through via is less than or equal to 17 times the maximum width of the dummy through vias at the first surface in a plan view.

Provided is a sensor apparatus that includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size of the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.

A circuit arrangement for capturing a position change of a component, comprising a printed circuit board. The component comprises a component portion with which the component is arranged on the printed circuit board and is aligned therewith. At least one movement direction is provided, in which the component moves in the event of a position change. At least one resistor is arranged in the movement direction with a tolerance distance from the component portion such that, in the event of a position change of the component, the tolerance distance is exceeded so that the component portion shears the resistor.

A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.

A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.