Disclosed are various embodiments relating to an electronic device that includes a key An electronic device may include a housing having a through-hole formed therein. A key may be exposed through the through-hole and configured to be pressed. A key switch may be located on a rear surface of the key, wherein the key structure may be configured to enable the key to be pressed and to detect the press of the key. Moreover, a structure provided on a lower portion of the housing may be able to bear a pressure exerted by a user when pressing the key in a direction opposite the housing. Further, a dummy detachably provided between the housing and the structure, wherein the dummy, when being attached, may support the key and the key switch such that both are capable of being pressed in the through-hole toward the direction of the structure.

A rollable display apparatus includes a flexible panel including a main panel with a display and a dummy panel with a wire connected to the display, a housing to accommodate the flexible panel, a rotatable rolling drum in the housing and coupled to a first end of the flexible panel, a supporting base moveable into and out of the housing and coupled to a second end of the flexible panel, and a printed circuit board connected to the second end of the flexible panel, the printed circuit board being on the supporting base.

An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

A circuit board to be mounted on a casing of a cartridge includes an insulating substrate, an integrated circuit mounted on the substrate, terminals and a dummy electrode. The terminals are electrically connected to the integrated circuit, while the dummy electrode is electrically disconnected from the integrated circuit. The terminals and dummy electrode are formed on the substrate to satisfy an inequity of L1+L2<L3, where L1 is a shortest distance among distances between edges of the terminals and an edge of the dummy electrode in a direction perpendicular to a predetermined direction in which the terminals are aligned with one another; L2 is a shortest distance between an edge of the dummy electrode and an edge of the casing in the predetermined direction; and L3 is a shortest distance among distances between edges of the terminals and the edge of the casing in the predetermined direction.

A wiring board includes a first insulating layer, a pad formed on one surface of the first insulating layer, a second insulating layer, formed on the one surface of the first insulating layer, and including an opening exposing the pad, and a reinforcing metal layer formed in contact with the first insulating layer, and provided around the pad so as to be separated from the pad in a plan view. The pad is disposed inside the opening without making contact with the second insulating layer. An end, on a side of the first insulating layer, in a portion of an inner side surface of the opening of the second insulating layer makes contact with the reinforcing metal layer, and an end in another portion of the inner side surface of the opening of the second insulating layer makes contact with the one surface of the first insulating layer.

A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.

An array circuit board 11B includes a glass substrate, an IC chip 20, two ACFs 30, and a resin film 32. The IC chip 20 is disposed on the glass substrate. The ACFs 30 are disposed between the glass substrate and the IC chip 20 for electrically connecting the glass substrate and the IC chip 20 together. The ACFs 30 are separated from each other. The resin film 32 is made of resin material having cure shrinkage smaller than the ACFs 30 and disposed to fill a gap between the ACFs 30 adjacent to each other between the glass substrate and the IC chip 20.

A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

According to one embodiment, an electronic device includes a circuit board and a circuit component on an upper surface or a lower surface of the circuit board. The circuit component includes a first ceramic capacitor and a second ceramic capacitor. Vibration characteristics of the first ceramic capacitor and a second ceramic capacitor are opposed to each other. The first ceramic capacitor is near the second ceramic capacitor to cause vibrations of the first and second ceramic capacitors to cancel each other.

A semiconductor substrate includes: (1) a first dielectric structure having a first surface and a second surface opposite the first surface; (2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure defining a through hole extending from the third surface to the fourth surface, wherein a cavity is defined by the through hole and the first dielectric structure; (3) a first patterned conductive layer, disposed on the first surface of the first dielectric structure; and (4) a second patterned conductive layer, disposed on and contacting the second surface of the first dielectric structure and including at least one conductive trace, wherein the first dielectric structure defines at least one opening, and a periphery of the opening corresponds to a periphery of the through hole of the second dielectric structure.