In one embodiment, a substrate includes a glass core layer with a plurality of coaxial through glass vias (TGVs). The coaxial TGVs include a first conductive portion and a second conductive portion with a dielectric therebetween. An outer conductive portion of the coaxial TGV may be formed using electroplated metal while an inner conductive portion of the TGV may be formed using metal sintering paste.

Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a connection board, and a second electronic component. The circuit board has a circuit board body and a first electronic component, and the first electronic component is located on the circuit board body. A first signal hole is provided on the circuit board body. The connection board is located on a side of the circuit board body opposite to the first electronic component, and is in conduction with the first electronic component through the first signal hole. The second electronic component is in conduction with the connection board.

A data processing system is disclosed. The data processing system may include a processor, memory module, and circuit board. The circuit board may include a first socket for the processor. The circuit board may include a second socket for the memory module. The circuit board may also include a first physical memory channel interconnecting a first portion of the first socket and a first portion of the second socket. The circuit board may additionally include a second physical memory channel interconnecting a second portion of the first socket and a second portion of the second socket.

A flexible printed circuit board includes a base film, a wiring layer disposed on the base film and a plurality of conductive balls partially embedded in the upper surface of the wiring layer. A display device includes a display panel including a display area and a peripheral area, a flexible printed circuit board facing and bonded to a pad portion disposed in the peripheral area and a nonconductive film disposed between the pad portion and the flexible printed circuit board, wherein the flexible printed circuit board includes a plurality of conductive balls partially embedded on an upper surface of a wiring layer disposed on a base film, and the pad portion has a portion that comes into contact with the plurality of conductive balls.

An apparatus may include a host circuit board supporting a heat-producing electronic component, a rotor for an axial flux motor, and fan blades supported by the rotor. The host circuit board may include traces forming windings for the axial flux motor. The rotor may be supported by and rotatable relative to the host circuit board to generate a flow of cooling fluid to cool the first heat-producing electronic component.

A printed circuit board is provided. The printed circuit board includes a glass layer having a through-hole; an insulating material disposed within the through-hole and having a via hole; and a metal via disposed within the via hole. The metal via includes a first metal layer that is substantially conformally disposed on a wall surface of the via hole, a second metal layer that is substantially conformally disposed on the first metal layer, and a third metal layer disposed on the second metal layer and filling at least a portion of the via hole.

An aerosol generating device includes a power supply, a first circuit board on which a processor is mounted, a second circuit board, which is arranged spaced apart from the first circuit board and has mounted thereon a radio frequency (RF) signal generation circuit configured to generate an RF signal by using power supplied from the power supply and at least one amplifier configured to amplify the generated RF signal, and a radiating unit configured to heat an aerosol-generating article by radiating the amplified RF signal in the form of electromagnetic waves into an insertion space into which the aerosol-generating article is inserted, wherein the processor is configured to control the RF signal generation circuit and the at least one amplifier.

A control module for a high-power electric motor may include a metal base, an insulating wall fastened to the metal base, and a circuit board disposed within the insulating wall. The circuit board may include a first surface that faces the metal base and a second surface opposite the first surface. A plurality of power switches may be mounted on the first surface of the circuit board and configured as an inverter circuit. A thermally conductive electrically insulating layer may be between the circuit board and the metal base. Power output terminals may be mounted on the second surface of the circuit board. An insulating frame may extend between at least one pair of the power output terminals. One or more fasteners may be received through the insulating frame, the circuit board, and the thermally conductive electrically insulating layer and fastened to the metal base.

The embodiments of the present disclosure provide a board and a server, which relates to the technical field of processor board card interconnection. By arranging the first internal connectors in the second internal connector configuration area and the second internal connectors in the first internal connector configuration area; the first processor is electrically connected to the first internal connectors through the first circuit, and the second processor is electrically connected to the second internal connectors through the second circuit, and the first circuit and the second circuit are arranged in an intersecting way. Based on the wiring design of the board of the embodiments of the present disclosure for multi-board interconnection, the complexity of the cable topology structure in the board group may be effectively simplified, thereby improving the maintenance efficiency of multi-card interconnection, and reducing the construction difficulty and maintenance cost.