A differential pair contact resistance asymmetry compensation system includes a board with a differential trace pair. A receiver device is coupled to the differential trace pair via a receiver device connector interface, and a transmitter device is coupled to the differential trace pair via a transmitter device connector interface. The transmitter device transmits a contact resistance compensation data stream to the receiver device via the differential trace pair. The transmitter device then adjusts an impedance provided by the transmitter device to compensate for a contact resistance asymmetry in the transmitter device connector interface. When the transmitter device determines that differential trace pair signal transmission capabilities for the differential trace pair in transmitting the contact resistance compensation data stream have improved in response to the adjustment of the impedance provided by the transmitter device, it sets the impedance provided by the transmitter device.

A control apparatus includes an electronic controller configured to execute software for controlling a vehicle, and a control board configured to provide a mounting space for the electronic controller and connect the electronic controller and an external device with a signal line, wherein the control board includes a circuit board having the signal line disposed on at least one of an outer surface and an inner surface; and an access point through which an external device is connected, disposed at a set location on the circuit board, and wherein the access point is separable or removable by an external force after signal transmission for a final testing or final software changes of the electronic controller is completed.

Monolithic power stage (Pstage) packages and methods for using same are provided that may be implemented to provide lower thermal resistance/enhanced thermal performance, reduced noise, and/or smaller package footprint than conventional monolithic Pstage packages. The conductive pads of the disclosed Pstage packages may be provided with a larger surface area for contacting respective conductive layers of a mated PCB to provide a more effective and increased heat transfer away from a monolithic Pstage package. In one example, the increased heat transfer away from the monolithic Pstage package results in lower monolithic Pstage package operating temperature and increased power output. In another example, a monolithic Pstage package may be provided with an adaptive application-oriented interface and a multi-function pin that allows the same monolithic Pstage package to automatically detect and select between a relatively higher power information handling system application, and a relatively lower power information handling system VR application.

There is provided a semiconductor apparatus including a first high-speed communication controller and a second high-speed communication controller that perform high-speed communication; a first high-speed communication terminal group that includes a first high-speed communication terminal for inputting a first signal; a second high-speed communication terminal group that includes a second high-speed communication terminal for inputting a second signal; and a terminal mounting surface, in which the terminal mounting surface includes a first side and a second side, a shortest distance from the first high-speed communication terminal group to the first side is shorter than a shortest distance from the second high-speed communication terminal group to the first side, and a shortest distance from the second high-speed communication terminal group to the second side is shorter than a shortest distance from the first high-speed communication terminal group to the second side.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.

Apparatuses and systems associated with expansion card design with a coherent connector to provide for coherent communication are disclosed herein. In embodiments, a circuit card may comprise an integrated circuit (IC), a first connector to couple the IC to a processor of a computer device, the first connector to provide for non-coherent communication between the IC and the processor, and a second connector to couple the IC to the processor, the second connector to provide for coherent communication between the IC and the processor. Other embodiments may be described and/or claimed.