A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

A system receives event information associated with an event that corresponds to a temperature of a memory sub-system including memory devices encased in respective packages. The system determines whether the event information associated with the event satisfies a threshold condition. Responsive to determining that the event information associated with the event satisfies the threshold condition, the system causes a thermoelectric component (TEC) that is coupled to an external surface of each of the respective packages of the memory devices of the memory sub-system to transfer thermal energy between the TEC and the memory devices via thermal conduction.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

A system configured to generate heat when supplied with a first fuel or a second fuel can include a fuel supply line operatively connected to a fuel source. A valve assembly can be operatively connected to the fuel supply line. A main burner can be operatively connected to the valve assembly. A thermoelectric generating system can be configured to transform heat to electricity. A first pilot burner can include at least one of a first thermocouple and a first Fe-ion sensor. A second pilot burner can include at least one of a second thermocouple and a second Fe-ion sensor. A printed circuit board (PCB) can be operatively connected to the valve assembly and the first and second pilot burners. The PCB can be configured to control operation of the valve assembly based on information received from at least one of the first and second pilot burners.

A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

The invention relates to a device (100) for emitting light, in particular for curing substances that cure when irradiated by light, in particular UV light, comprising—an electrical illumination body (1) having at least one thermal contact area (11) and at least two electrical connections (12a, 12b),—wherein the thermal energy that arises in the context of the emission of light is able to be dissipated via the thermal contact area (11),—wherein the illumination body (1) is applied to a carrier element (2),—wherein the carrier element (2) has at least one cutout (21) in the region of the thermal contact area (11) of the illumination body (1),—a heat sink (3), which is thermally conductively connected to the thermal contact area (11) of the illumination body (1) in the region of the cutout (21) in the carrier element (2), and—an NTC thermistor (4), which is electrically conductively connected to the electrical connections (12a, 12b) of the illumination body (1), wherein the NTC thermistor (4) is thermally conductively connected to the heat sink (3) and at the same time electrically insulated from the heat sink (3).

A board-like structure includes a base body, an internal conductor, a connection conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The connection conductor is connected to the internal conductor inside the base body. The terminal member is connected to the connection conductor inside the base body and is exposed to an external portion of the base body at the lower surface. The connection conductor is longer in length in a vertical direction than a thickness of the internal conductor in the vertical direction. In the terminal member, at least a side surface is connected to the side surface of the connection conductor.