A circuit assembly that includes a circuit board, a switching element that is mounted on one side of the circuit board, a folded portion that extends from a peripheral edge portion of the circuit board and is folded towards the one side, and a temperature measuring device that is mounted on the folded portion and is in contact with the switching element.

A thermoelectric conversion element includes a thermoelectric member that is columnar and an insulator formed around the thermoelectric member. Particles are enclosed between the thermoelectric member and the insulator.

A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a function of the apparatus (12); wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10). The control unit is provided with an injection moulded layer (22; 22′) encapsulating at least a part of the or each electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78).

An apparatus can comprise a DC power supply to generate a DC electrical signal, a pulse generator to generate an electrical pulse, and an electrical element. The pulse generator and the DC power supply can be electrically coupled together. The electrical element can receive the DC electrical signal and the electrical pulse. The electrical element can generate a magnetic field in response to receiving the DC electrical signal and cool in response to receiving the electrical pulse.

A display module includes a display panel on which an image is displayed, a driver chip which supplies a driving voltage to the display panel, a thermoelectric element disposed on a first surface of the display panel and which overlaps the driver chip in a plan view, and an embedded battery disposed on the first surface of the display panel, spaced apart from the thermoelectric element, and electrically connected to the driver chip and the thermoelectric element to supply power to the driver chip and the thermoelectric element.

A thermoelectric chiller for cooling an electronic device comprising a chassis and a heatsink, the heatsink having a flat side and an opposing side equipped with cooling fins, the chassis and heatsink adapted for cooperative engagement to create an air-sealed chamber with the heatsink cooling fins inside the chamber; a cold air inlet on an inlet side of the chamber, the cold air inlet equipped with one or more fans adapted to force ambient air into the chamber; a hot air exhaust on an exhaust side of the chamber, the hot air exhaust providing an outlet for air to leave the chamber; one or more Peltier effect elements, each having a hot side and a cold side, the one or more Peltier effect elements disposed so that their hot side is in thermal contact with the flat side of the heat sink; a cold plate disposed over the one or more Peltier effect elements and in thermal contact with the cold side of the one or more Peltier effect elements; a controller to control the operation of the one or more fans and the one or more Peltier effect elements.

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).

A camera module includes a printed circuit board, a sensor, and a refrigeration chip. A first receiving groove is defined in the printed circuit board. The sensor is received in the first receiving groove and electrically connected to the printed circuit board. The refrigeration chip is formed on and electrically connected to the printed circuit board. The refrigeration chip comprises a cold surface. The sensor is formed on the cold surface. The cold surface is configured to absorb heat from the sensor when the refrigeration chip is powered on. The camera module is capable of dissipating heat and controlling an internal temperature of the camera module.