The invention refers to a component carrier realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat-passage component, said at least one heat-passage component being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer or is embedded within at least one inner layer of the component carrier, and further comprising at least one latent-heat storage unit with a phase-change material. The phase-change material is arranged within at least one cavity and integrated within a laminated build-up of the component carrier and is directly thermoconductively coupled with the at least one heat-passage component. The invention also refers to a method for producing said component carrier.

Systems and methods for a printed circuit board assembly comprising a thermoelectric device at least partially embedded within the printed circuit board assembly are provided. The thermoelectric device is configured to adjust a temperature of the printed circuit board assembly based on the measurements of one or more sensors coupled to the printed circuit board assembly. Additionally, a control circuit is coupled to the at least one thermoelectric device and the one or more sensors, wherein the control circuit is configured to control the at least one thermoelectric device, and wherein the control circuit is configured to monitor a temperature set point at one or more target locations in the printed circuit board assembly.

The present invention relates to a carrier substrate (30) comprising signal vias (41) for electrically interconnecting components (10, 31) arranged on opposing sides of the carrier substrate (30). The carrier substrate (30) further comprises: at least one cavity (20) embedded in the carrier substrate (30) having at least one chamber wick part (24) and a working fluid, and wherein the at least one cavity (20) at least partially encompass the signal vias (41). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate (30).

An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

An electronic apparatus includes: a circuit board having a first surface, a second surface and an opening, wherein the opening is between the first surface and the second surface; a thermal conductive material at least partially passing through the opening, and in contact with the circuit board; at least an electronic device disposed on the first surface of the circuit board, and in contact with the thermal conductive material; a heat dissipation plate disposed on the second surface of the circuit board; and an insulated thermal conductive sheet disposed between the thermal conductive material and the heat dissipation plate. By virtue of it, product volume can be reduced effectively, and a flow channel is simplified.

An electronic device is disclosed. The electronic device includes a case and a battery cover forming an appearance of the electronic device and a printed circuit board mounted inside the case and provided with electronic elements. A measurement sensor is mounted on at least a portion of the printed circuit board. One surface of a recess of the printed circuit board, on which the measurement sensor is mounted, is formed at a different height from other portion of the printed circuit board in a thickness direction of the electronic device. The recess, on which the measurement sensor is mounted, is thinner than the other portion and is spaced apart from the other portion, and thus the electronic device can more accurately measure a body temperature of a user.

An apparatus can comprise a DC power supply to generate a DC electrical signal, a pulse generator to generate an electrical pulse, and an electrical element. The pulse generator and the DC power supply can be electrically coupled together. The electrical element can receive the DC electrical signal and the electrical pulse. The electrical element can generate a magnetic field in response to receiving the DC electrical signal and cool in response to receiving the electrical pulse.

A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.

A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.

First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.