A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A sensor for sensing ions, comprising a circuit board assembly, and a core assembly connected to the circuit board assembly, the core including a first electrical conductor and a second electrical conductor.

A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The aperture is partially filled with a solid dielectric material and partially filled with air. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.

A circuit structure includes a signal substrate having a signal trace formed thereon and a microstrip substrate disposed above the signal substrate that includes a microstrip trace formed thereon and a hole passing through it. The circuit structure also includes a conductor passing through and substantially filling the hole passing through the microstrip substrate and electrically contacting the signal trace on the signal substrate and a flat wire connector electrically connecting the microstrip trace to a first end of the conductor, the flat wire connector being arranged such that a gap is formed between the flat wire connector and a top surface of the microstrip substrate.

Disclosed is an electronic device for determining the angular position of a shaft of a motor vehicle, the device including a printed circuit board and a magnetic guide including at least two fastening tabs for fastening to the printed circuit board, the printed circuit board including a base substrate and at least two fastening areas for fastening the magnetic guide, each designed to receive a fastening tab of the magnetic guide, the fastening tab defining a fastening orifice. Each fastening area is defined on the base substrate of the printed circuit board and includes a pad fastened to the base substrate. Each fastening tab is joined to the pad of the corresponding fastening area by way of an adhesive that is applied in its fastening orifice.

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 m, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.

A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.