A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.

Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.

The electronic device includes a printed circuit board having a first main surface, an electronic part mounted on the first main surface, and a first connection member connecting the printed circuit board and the electronic part. The printed circuit board includes at least one projection formed on the first main surface so as to project in a direction crossing the first main surface. The projection is formed outside the bottom surface of the electronic part which is located at the side of the first main surface. The first connection member is in contact with at least part of the projection, at least part of the bottom surface of the electronic part, and at least part of a lateral surface of the electronic part intersecting the bottom surface.

An apparatus such as an appliance with a printed circuit board, PCB, (202) mounted haptic feedback device (200) is provided. The apparatus comprises a printed circuit board (PCB) having an opening (204) defined therein, and a spool (206) affixed to the PCB and having a shaft with a coil (208) wound thereabout. The shaft defines an opening aligned with the opening of the PCB. The apparatus also comprises a spring-loaded plunger positioned and movable within the opening of the shaft. The spring-loaded plunger includes a metallic disk operatively coupled to an end of the plunger and distally positioned to the spool. A control component of the apparatus is configured to energize the coil according to a haptic feedback pattern, and thereby cause the coil to at tract the metallic disk and move the plunger within the opening of the shaft of the spool, and through the opening of the PCB.

Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.

A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.

The electronic device includes a printed circuit board having a first main surface, an electronic part mounted on the first main surface, and a first connection member connecting the printed circuit board and the electronic part. The printed circuit board includes at least one projection formed on the first main surface so as to project in a direction crossing the first main surface. The projection is formed outside the bottom surface of the electronic part which is located at the side of the first main surface. The first connection member is in contact with at least part of the projection, at least part of the bottom surface of the electronic part, and at least part of a lateral surface of the electronic part intersecting the bottom surface.

An apparatus such as an appliance with a printed circuit board, PCB, (202) mounted haptic feedback device (200) is provided. The apparatus comprises a printed circuit board (PCB) having an opening (204) defined therein, and a spool (206) affixed to the PCB and having a shaft with a coil (208) wound thereabout. The shaft defines an opening aligned with the opening of the PCB. The apparatus also comprises a spring-loaded plunger positioned and movable within the opening of the shaft. The spring-loaded plunger includes a metallic disk operatively coupled to an end of the plunger and distally positioned to the spool. A control component of the apparatus is configured to energize the coil according to a haptic feedback pattern, and thereby cause the coil to at tract the metallic disk and move the plunger within the opening of the shaft of the spool, and through the opening of the PCB.