The movable coil for a flat plate speaker according to an embodiment of the present invention includes a PCB coil and a metal coil. The PCB coil plate forms a single layer or multiple layers. In the PCB coil, a coil track is spirally pattern-printed on a single layer PCB coil plate. Otherwise, each of a plurality of coil tracks is spirally pattern-printed on each of multilayer PCB coil plates, and, the plurality of coil tracks are electrically connected to each other. The metal coil is electrically connected to the PCB coil and wound in a planar spiral shape. The coil track includes straight section effective tracks patterned on the upper and lower portions of one surface of the PCB coil plate, respectively, and idle tracks patterned on left and right portions of the one surface of the PCB coil plate, respectively. The straight section effective tracks are formed by connecting multiple lines in parallel, the idle tracks are formed by singular lines, and the coil track is formed in a spiral shape as multiple lines and singular lines are alternately repeated.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

A device for driving a compressor of a vaporous fluid which exhibits a housing with a cooling surface and a power supply arrangement with at least one switching element, at least one PCB, as well as at least one spring element for applying a spring force on the at least one switching element. The switching element is connected to the PCB. The cooling surface and the PCB are arranged relative to one another in a direction z with spacing. The at least one switching element is arranged such that it is in contact with the housing with a first surface in the area of the cooling surface and that the at least one spring element for pressing the switching element against the cooling surface is in contact with a second surface of the switching element.

Current leakage interrupter, having a shell consisting of an upper shell and a lower shell, a PCB inside the shell, a detection device and a trip device mounted to the PCB, power lines electrically connected to the trip device through the detection device, and pins electrically connected to the trip device. The lower shell has pin holes; front ends of the pins extend out of the pin holes. A reverse hook is provided at an inner side of the lower shell at an edge of each pin hole to fix onto a first side of a rear end of a corresponding pin; a second side of the rear end of each pin is extended and bended into a bended portion; a supporting seat is also provided at the inner side of the lower shell at the edge of each pin hole to support the bended portion of the corresponding pin.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A printed circuit board, including: a contact point for contacting; a contact spring for an electrical contact in a vehicle; in which the contact point has a support element of tin that is reflow soldered to the printed circuit board. Also described are a related module and method.

Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

A coupler includes: a first layer including a first conductive flat plate; a second layer including a signal transmission line electrically connected to the first conductive flat plate, the second layer including a first line port configured to input a signal output from a wireless communication circuit, and a second line port electrically connected to an antenna; a third layer electrically connected to the first conductive flat plate and including a first conductive pattern electrically connected to the signal transmission line; and a capacitor electrically connected to the first conductive flat plate.