A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.

An electrical interconnection system for electrical components of a module includes a hub printed circuit board (PCB) having a first electrically conductive track and a second electrically conductive track. Each of the first and second electrically conductive tracks is configured to electrically connect at least two of the electrical components of the module, wherein the at least two of the electrical components of the module are external to the hub PCB. The system also includes multiple electrical terminals, wherein each of the electrical terminals is configured to electrically connect one of the first and second electrically conductive tracks of the hub PCB to one of the at least two electrical components of the module.

Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

A biosensor cartridge can include a circuit board having a connection terminal configured to be electrically connected to an external diagnostic device, a biosensor chip configured to detect a target material from an analysis specimen, and transmit an electrical signal to the connection terminal of the circuit board based on the target material being present in the analysis specimen, the biosensor chip including a reactant configured to react specifically with the target material, and a housing enclosing the circuit board and the biosensor chip, and the connecting terminal being exposed outside of the housing. Also, the biosensor chip includes a plurality of channel areas separated from each other, and the reactant is attached to the plurality of channel areas.

A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A joystick device is provided. The joystick device includes a housing, a joystick assembly, a reset assembly, a translation assembly, and a circuit board. A magnetic component is located on the translation assembly, and a magnetic induction element is located on the circuit board. The joystick assembly pushes the translation assembly to translate, and the magnetic induction element generate an output that changes with the movement of the translation assembly. A handle using the joystick device also provided.