The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A connection structure, of a short bar forming a conductive path and a land on a printed circuit board, in which the short bar includes a plate portion having a flat plate shape and a protrusion protruding in a stepped shape from a surface of the plate portion, the protrusion is threadably fastened to the printed circuit board by a screw inserted into a land-side through hole formed through the land, from an opposite side of the printed circuit board with respect to the protrusion, in a state where a flat surface portion formed, at a position spaced apart from the surface of the plate portion, on an outer surface of the protrusion is in close contact with the land.

A smart plug that is partitioned into a plurality of printed circuit boards (PCBs) in a three dimensional manner to reduce its size. Aspects consider the effect of the possible increased internal temperature as the size of the smart plug is reduced. For example, thick metal foils connect various components of a smart plug to reduce heat dissipation within the smart plug. Also, a metal foil may transfer heat from contact metal on a PCB to a side wall of a plastic housing of the smart plug. The smart plug may comprise a computing device that obtains information identifying the attached electrical device and accesses device data about the time duration during which the attached electrical device exhibits transient characteristics. The computing device then uses the accessed data to effectively control the attached electrical device.

It is presented an inverter type motor drive device for feeding three phase AC electric power to an electric motor, the inverter type motor drive device comprising: an insulated metal substrate board on which, for each of the three phases, a plurality of power switches are mounted in straight lines in switch assemblies along a first direction; a printed circuit board on which a plurality of capacitors are mounted; and two DC power input terminals. The inverter type motor drive device further comprises three AC power output terminals, each extending through the printed circuit board while avoiding galvanic contact with the printed circuit board, and each of the three AC power output terminals comprise an elongated AC busbar, wherein a longitudinal direction of the AC busbar extends along the first direction.

The invention relates to the application of electrically conductive bus bars onto a low-emissivity coating of glass. A method of applying electrically conductive bus bars onto a low-emissivity surface of glass is performed by gas dynamic cold spray method with the aid of a spraying nozzle of a gas dynamic spraying apparatus. The method comprises: providing in the gas dynamic spraying apparatus an estimated bulk weight of a powder, sufficient for spraying the powder over the entire length of the bus bar; moving the spraying nozzle to a beginning point of the bus bar without supplying the sprayed powder into the nozzle, and upon positioning the moving nozzle at the beginning point of the bus bar, supplying the sprayed powder into the spraying nozzle and moving the spraying nozzle with a constant speed from the beginning point to an end point of the bus bar. Upon reaching the end point of the bus bar, the movement of the nozzle is reversed towards the beginning point of the bus bar with a speed greater than the speed of the nozzle from the beginning point to the end point of the bus bar.

A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

An ultra capacitor module includes a first ultra capacitor having a first polar terminal provided with a screw thread A formed on an outer peripheral surface, a second ultra capacitor having a second polar terminal provided with a screw thread A formed on an outer peripheral surface, and a connecting member having a screw hole B formed corresponding to the screw thread A on an inner peripheral surface through which the first polar terminal is inserted from one side and the second polar terminal is inserted from the other side to connect the first and second ultra capacitors in series and having a gas emission hole formed from a center to an outer surface.

A film-like printed circuit board includes: a low-melting-point resin film substrate composed of a low-melting-point resin in which a melting point is 370° C. or less; a circuit formed in a manner that a circuit-forming conductive paste applied onto the low-melting-point resin film substrate is subjected to plasma baking; an electronic component bonding layer formed in a manner that a mounting conductive paste applied onto the circuit is subjected to the plasma baking; and an electronic component mounted on the circuit via the electronic component bonding layer.

A mechanical and electrical connection system including a printed circuit board, a busbar and an electrical component, wherein the board includes a first orifice in which a bottom foot of the bar is received and includes a second orifice in which a lug of the component is received, and wherein the bar includes an elastically deformable clamp which receives the lug of the component.