A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.

Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

A connector-attached circuit body include a circuit body including a flexible substrate having a wiring pattern, and a connector attached to the circuit body and including a terminal and a housing that accommodates the terminal. The terminal is electrically connected to the wiring pattern and extends in a thickness direction of the circuit body.

An electronic device includes a bus bar that includes a first terminal and a second terminal and extends between the first terminal and the second terminal on a side of a first surface of a substrate; first solder configured to pass through the substrate in a thickness direction and connect a first through terminal connected to a first electronic component that is disposed on a second surface side of the substrate and the first terminal; and second solder configured to pass through the substrate in the thickness direction and connect a second through terminal connected to a second electronic component disposed on the second surface side of the substrate and the second terminal.

An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.

An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body.

A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

A power storage module includes: a stack in which a plurality of power storage cells are stacked in a stacking direction; a resin plate having a bottom surface portion and placed on the stack of the plurality of power storage cells; a flexible printed circuit board placed on the bottom surface portion of the resin plate and having an electric circuit electrically connected to the plurality of power storage cells; a connector for the electric circuit, the connector being fixed to the flexible printed circuit board; and a substrate that supports the flexible printed circuit board and the connector, the substrate being fixed to the resin plate with the substrate being positioned in an extending direction of the bottom surface portion of the resin plate.