An electrical contact, a 3D LED and a method of manufacturing 3D LEDs are described. The electrical contact includes a printed circuit board (PCB) bridge and a PCB connector. The PCB bridge comprises at least one electrical contact. The at least one electrical contact is configured for electrical coupling with at least one interposer of a string of LEDs. The PCB connector is electrically coupled to the PCB bridge. The PCB connector comprises an electrical contact configured for electrical coupling with at least one external electrical wire.

The present disclosure discloses a display, a multi-circuit board and a manufacturing method thereof, the multi-circuit board at least comprises a first circuit board, a second circuit board and a lead thin film used to connect with the first circuit board and the second circuit board, the lead thin film comprises two thin films and at least one lead encapsulated between the two thin films, the first circuit board and the second circuit board being connected with each other through at least one lead, the thin film is a thin film substrate of chip on film, COF. The present disclosure also discloses a display and a manufacturing method of a multi-circuit board. Through the above way, the present disclosure can reduce the manufacturing cost of the multi-circuit board.

A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

An apparatus including a board, an inductor that is provided on the board, a guard ring that includes a first guard ring part provided to be adjacent to a circumference of the inductor and a second guard ring part provided to be adjacent to an outer side of the first guard ring part, in which one end of the second guard ring part is connected to one end of the first guard ring part, and a first power supply that is connected to another end of the first guard ring part and another end of the second guard ring part.

An LED luminaire and potting method having the following steps: introducing a configured luminaire into an at least partly optically transparent potting mold (16), such that the luminaire does not come into contact with the walls of the potting mold; introducing an optically transparent potting compound (18) into the potting mold (16) until at least the luminaire is surrounded; and detecting a quantity of bubbles by an optical sensor or image detector (14), wherein the pressure in the vacuum chamber (11) is controlled in order to influence the bubbles and/or a pivot/inclination device (12) is controlled in order to move the vacuum chamber (11) and/or the potting mold (16) in order to expel detected gas/air bubbles (19) out of the optically transparent potting compound (18).

The first capacitor is opposed to and electrically connected to the first back electrode. The second capacitor is opposed to and electrically connected to the second back electrode. Each of the first circuit and the second circuit has a main region that overlaps with a corresponding one of the first capacitor and the second capacitor. At least one circuit of the first circuit and the second circuit has an extension region extending from the main region toward another circuit of the first circuit and the second circuit. At least one of one of the pair of first wires and the second wire is bonded to the extension region.

An illumination device includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element. The lamp seat includes a light exiting mount region. The primary circuit is disposed on the circuit board. The secondary circuit is disposed at the light exiting mount region. The conductive wires electrically connect the primary and secondary circuits. The light-emitting element is disposed at the light exiting mount region and is electrically connected to the secondary circuit. Another illumination device is also provided, which includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element.

A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 .Math.m to 0.5 .Math.m or a 10-point average roughness in a range of 1.0 .Math.m to 5.0 .Math.m.

A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.

A semiconductor package includes a first substrate, a first conductive layer, a first surface mount device (SMD) and a first bonding wire. The first substrate has a first top surface. The first conductive layer is formed on the first top surface and has a first conductive element and a second conductive element separated from each other. The first SMD is mounted on the first top surface, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.