An electrical terminal includes a terminal body, at least one interference lug, and at least one circuit connection part. The terminal body includes a front end and a back end in a longitudinal direction. The interference lug is arranged in parallel to the longitudinal direction and extends outwardly in a horizontal direction perpendicular to the longitudinal direction. The at least one circuit connection part is connected to the terminal body. An electrical connector is also provided, and the electrical connector includes a base and the electrical terminal. The base includes at least one installation trough, and a guiding groove is arranged in the at least one installation trough, the at least one interference lug is adapted to slide into the guiding groove, so as to guide and position the electrical terminal.

An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.

An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element. The sealing ring can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery of the first circuit board element and flows into recesses of the microstructures and, after the curing, forms the form-closed and sealing connection between the two circuit board elements and the sealing ring thereby formed.

A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.

A conductive terminal is adapted to electrically connect a wire to a circuit board. The circuit board has a through hole and solder pads on a surface of the circuit board. The conductive terminal comprises a base, a pair of mounting portions, and a pair of clamping portions. The base has a pair of opposing first edges, a pair of opposing second edges, and an insertion hole aligned with the through hole of the circuit board. The mounting portions include a pair of solder portions extending outwardly from the first edges and parallel to the base. The solder portions are each adapted to be soldered to one of the solder pads of the circuit board. The clamping portions extend obliquely toward each other from the two second edges of the base and are adapted to clamp a conductor of the wire inserted through the insertion hole and the through hole.

A first connector is soldered to a first board. A second connector is soldered to a second board. A third connector and a fourth connector are soldered to a relay board. The third connector is connected to the first connector via a first power line. The fourth connector is connected to the second connector via a second power line. A surface to which the first connector is soldered on the first board is opposite to a surface to which the first connector is attached on the first board. A surface to which the second connector is soldered on the second board is a surface to which the second connector is attached on the second board. Only surface-mount devices are used as electronic components soldered to the second board.

A power supply voltage terminal and a ground terminal having a rectangular cross section are respectively connected to a first terminal hole of a power supply pattern and a second terminal hole of a ground pattern. An inductor is surface-mounted on a substrate, and has a rectangular parallelepiped shape in which an input end connected to a power supply pattern and an output end connected to a power supply relay face each other. A first electrode terminal of a capacitor is connected to the power supply pattern, a second electrode terminal is connected to the ground pattern, and constitutes a filter circuit together with the inductor. A wall surface of an input end of the inductor is arranged parallel to the longitudinal axis direction (x direction) of the first terminal hole. The inductor opposes the first terminal hole so as to include the entire length Wh of the first terminal hole within the width Wt of the input end in the x direction.

A conductive terminal electrically connects a conductor of a conductive wire to a circuit board. The conductive terminal includes a body, a clamping portion having a pair of clamping arms, and a solder portion having a pair of solder lugs. The body has an opening through which the conductive wire is inserted and a passage communicating with the opening, the passage receiving the conductive wire and extending perpendicular to a surface of the circuit board. The pair of clamping arms extend from the opening towards the circuit board and obliquely towards each other so as to clamp the conductor of the conductive wire inserted through the opening. The solder portion has a pair of solder lugs extending perpendicular to a lengthwise direction of the passage and soldered to a pair of solder pads on the circuit board.

A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.

A display device and a method of manufacturing the display device are capable of substantially minimizing damage to a display panel. The display device includes: a first substrate including a display area and a pad area; a polarization film disposed at an upper surface of the first substrate to overlap the display area; a flexible printed circuit board disposed at a lower surface of the first substrate; a via hole defined through the first substrate at the pad area; and a connection metal located at the via hole. The connection metal includes a connection portion disposed in the via hole and a first protruding portion that protrudes with respect to the first substrate, and the polarization film is spaced apart from the via hole in a plan view.