A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A connector includes lead parts and terminal parts to be connected to lands of a substrate, respectively. An anisotropic conductive joining member (ACJM) is mounted in a region where the lead parts are located. The ACJM is a resin in which solder particles are dispersed. The resin can melt at a temperature lower than the melting point of the solder particles. Cream solder is placed on the lands to be connected to the terminal parts. The substrate on which the connector is mounted is passed through a reflow oven to heat both the substrate and the connector. The connection between the terminal parts and the lands by reflow soldering and the connection between the lead parts and the lands via the ACJM 40 are performed simultaneously with each other.

A system may comprise a printed circuit board (PCB) including a top surface, and a bracket including a top surface configured to receive and couple to a key switch and a bottom surface including at least two protrusions that extend normal to the bottom surface of the bracket. The bracket can be configured to mount to the PCB such that the bottom surface of the bracket is coupled to the top surface of the PCB, and the at least two protrusions may each include conductive leads that couple to the top surface of the PCB. The bracket is configured to only cover a portion of a bottom surface of the key switch when coupled to the key switch. An LED can be mounted to the top surface of the PCB, laterally adjacent to the bracket, and under the key switch at a location not covered by the bracket.

An electronic device includes a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board; a connection member electrically connecting the first printed circuit board and the second printed circuit board, the connection member including a first connection part connected to the first printed circuit board and a second connection part connected to the second printed circuit board; and a first intermediate member including: a first connector provided on a first surface of the first intermediate member facing the first printed circuit board and electrically connected to the first printed circuit board; and a second connector provided on a second surface of the first intermediate member opposite to the first surface and electrically connected to the connection member and the first connector, wherein the first connector and the second connector are separated from each other in a first direction.

An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

A detachable capacitor connection structure is provided for a storage device. In an embodiment, a connection element detachably connects a capacitor module including one or more capacitors to a circuit board such that the capacitor module is stacked over the circuit board. The connection element includes: a first connector including two pin headers, mounted on a bottom plane of the capacitor module; and a second connector including two sockets, mounted on a top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.

A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.

A connector assembly is provided. The connector assembly includes a socket to receive a plug and having an electrical contact. The connector assembly further includes a flexible fabric embedded with a pattern of electrically conductive elements and spanning the socket to conceal the electrical contact. The flexible fabric can deform toward the electrical contact of the socket to cause at least a portion of the pattern to contact the electrical contact.

The invention relates to an overvoltage protection arrangement for information and telecommunication technology, consisting of a housing with means formed on the housing base for mounting top-hat rails, overvoltage protection elements which can be found in the housing, electric connection means, and at least one circuit board as a wiring support for the overvoltage protection elements. When viewed laterally, the housing is designed approximately in the shape of a T standing on its head and has a beam-shaped main part with a protruding head part, wherein the electric connection means can be accessed and actuated via the upper face of the beam-shaped main part. A first and second circuit board are located on a respective inner face of the lateral walls of the housing in a mutually spaced manner, and the electric connection means in the form of electric connection terminals, connection sockets, and/or plugs for example are arranged in the spacing between the first and second circuit board such that first connection means can be accessed on the horizontal plane of the beam-shaped main part and second connection means can be accessed on the vertical plane of the beam-shaped main part. The flat shape of the circuit board corresponds to the T shape of the housing or approximates the shape of the housing.